FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
FH12-33S-0.5SH(54) Hirose	CONN FFC BOTTOM 33POS 0.50MM R/A	0
10FMN-BMT-A-TF(LF)(SN) JST	CONN FFC VERT 10POS 1.00MM SMD	6765
0528080871 Woodhead - Molex	CONN FFC FPC VERT 8POS 1MM SMD	0
0015474077 Woodhead - Molex	CONN CIC FFC RCPT 7POS 2.54MM	2875
FFC3B07-10-T Global Connector Technology, Limited (GCT)	10W, 1.0MM FFC CONN, R/A,BOT CON	4482
1-1734742-0 TE Connectivity AMP Connectors	CONN FFC VERT 10POS 0.50MM SMD	6519
AYF533035A Panasonic	CONN FFC FPC 30POS 0.50MM R/A	0
FH52E-68S-0.5SH(99) Hirose	CONN FFC 68POS .5MM	500
SFW22S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 22POS 1MM SMD	924
1734248-8 TE Connectivity AMP Connectors	CONN FPC VERT 8POS 1.00MM SMD	4986
0522712079 Woodhead - Molex	CONN FPC BOTTOM 20POS 1.00MM R/A	199
0522070733 Woodhead - Molex	CONN FFC FPC TOP 7POS 1.00MM R/A	5692
84982-4 TE Connectivity AMP Connectors	CONN FFC FPC VERT 4POS 1MM SMD	30587
84533-8 TE Connectivity AMP Connectors	CONN FFC TOP 8POS 1.25MM R/A	20528
046288010000846+ KYOCERA Corporation	CONN FFC BOTTOM 10POS 0.50MM R/A	5000
SFW4R-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 4POS 1.00MM R/A	13152
FH12-36S-0.5SH(54) Hirose	CONN FFC BOTTOM 36POS 0.50MM R/A	0
FH28-40S-0.5SH(98) Hirose	CONN FFC BOTTOM 40POS 0.50MM R/A	0
68711414522 Würth Elektronik Midcom	CONN FPC BOTTOM 14POS 0.50MM R/A	0
84533-5 TE Connectivity AMP Connectors	CONN FFC TOP 5POS 1.25MM R/A	9073

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities