FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
FH33-4S-1SH(10) Hirose	CONN FFC BOTTOM 4POS 1.00MM R/A	828
FH12-35S-0.5SH(55) Hirose	CONN FFC BOTTOM 35POS 0.50MM R/A	2036
FH12A-28S-0.5SH(55) Hirose	CONN FFC TOP 28POS 0.50MM R/A	29
687308124422 Würth Elektronik Midcom	CONN FPC VERT 8POS 0.50MM SMD	943
XF3M109151BR100 Omron Electronics Components	CONN FFC FPC 9POS 1.00MM R/A	0
046809611110846+ KYOCERA Corporation	0.5MM PITCH - 11 POS - RT ANGLE	1139
AYF331335 Panasonic	CONN FPC 13POS 0.30MM R/A	8269
F52L-1A7A1-11020 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	988
AYF531065 Panasonic	CONN FPC 10POS 0.50MM R/A	0
0545481671 Woodhead - Molex	CONN FFC BOTTOM 16POS 0.50MM R/A	2111
FH34SRJ-18S-0.5SH(50) Hirose	CONN FFC FPC 18POS 0.50MM R/A	6924
0039532035 Woodhead - Molex	CONN FFC VERT 3POS 1.25MM PCB	7647
FH36-29S-0.3SHW(99) Hirose	CONN FPC BOTTOM 29POS 0.30MM R/A	440
FH19C-30S-0.5SH(10) Hirose	CONN FFC BOTTOM 30POS 0.50MM R/A	2086
FX16M2-51P-HC Hirose	CONN FFC PLUG 51POS 0.50MM	70
0545480533 Woodhead - Molex	CONN FFC BOTTOM 5POS 0.5MM R/A	8028
0526102672 Woodhead - Molex	CONN FPC VERT 26POS 1.00MM SMD	525
0527451497 Woodhead - Molex	CONN FFC TOP 14POS 0.50MM R/A	4733
487576-9 TE Connectivity AMP Connectors	CONN FFC VERT 17POS 1.27MM PCB	1854
FFC2B28-14-G Global Connector Technology, Limited (GCT)	14W,0.5MM FFC CON,R/A,DUAL CONT,	7529

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities