D-Sub (D-subminiature) connectors and D-Shaped housings are metal-shelled electronics connectors characterized by their D-shaped mating interface. They ensure mechanical polarization and reliable signal/power transmission in critical applications. These components remain essential in industrial automation, telecommunications, and aerospace systems despite the rise of newer connector standards.
| Type | Functional Features | Application Examples |
|---|---|---|
| Standard D-Sub Housings | 9-104 contacts, 5-60A rating, basic EMI shielding | RS-232 serial ports, industrial control panels |
| High-Density Housings | Double-deck contacts, 26-104 contacts | Telecom backplanes, military data links |
| Waterproof Housings | IP67 rating, sealed mating interfaces | Marine instrumentation, outdoor telecom cabinets |
| Right-Angle Housings | 90 PCB mount, space-saving design | Embedded industrial computers, test equipment |
Typical D-Shaped housing consists of: - Metal Shell: Brass or zinc alloy with EMI/RFI shielding - Insulation Body: High-temperature resistant thermoplastic - Contact Arrangement: Multiple rows of signal/power pins - Mounting Features: Threaded inserts or panel clamps - Optional: Sealing gaskets, polarization keys
| Parameter | Importance |
|---|---|
| Current Rating (5-60A) | Determines power transmission capacity |
| Contact Resistance ( 10m ) | Impacts signal integrity |
| Dielectric Strength (1000VAC) | Ensures electrical safety |
| Operating Temperature (-55 C to +125 C) | Defines environmental tolerance |
| Shielding Effectiveness (60-100dB) | EMI/RFI protection level |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Amphenol | D38999 Series III | Military-grade sealing, 100G vibration resistance |
| TE Connectivity | DEUTSCH DT Series | High-density 96 contacts, quick-latch system |
| Molex | MICRO D HDM Series | 0.050" contact spacing, 10Gbps data rate |
Current development directions include: - Miniaturization: 0.025" contact pitch prototypes - High-speed capabilities: Differential pair designs for 25Gbps+ - Material innovation: Conductive polymers replacing metal shells - Environmental compliance: Halogen-free flame retardant materials - Smart integration: Embedded sensors for condition monitoring