D-Sub, D-Shaped Connectors - Housings

Image Part Number Description / PDF Quantity Rfq
1731070182

1731070182

Woodhead - Molex

CONN D-SUB HOUSING RCPT 21POS

200

1731090323

1731090323

Woodhead - Molex

FCT DSUB CRP PLG 09 PN

0

1731071445

1731071445

Woodhead - Molex

CONN HOUSING

0

1731140518

1731140518

Woodhead - Molex

CONN HOUSING

0

1731130071

1731130071

Woodhead - Molex

CONN D-SUB HD HOUSING PLUG 26POS

0

1731130074

1731130074

Woodhead - Molex

CONN D-SUB HD HOUSING RCPT 26POS

0

1731070375

1731070375

Woodhead - Molex

FCT ML DSUB RA PC PLG 8W8 W/CLIN

0

1731070171

1731070171

Woodhead - Molex

CONN D-SUB HOUSING PLUG 13POS

179

1731140220

1731140220

Woodhead - Molex

FCT DSUB CRP RCPT 15 PN NM

0

1731130022

1731130022

Woodhead - Molex

CONN D-SUB HD HOUSING PLUG 62POS

0

1731090435

1731090435

Woodhead - Molex

FCT DSUB CRP RCPT 09 PN

0

1731070693

1731070693

Woodhead - Molex

CONN HOUSING

0

1731070307

1731070307

Woodhead - Molex

CONN D-SUB HOUSING PLUG 7POS

0

1731070186

1731070186

Woodhead - Molex

CONN D-SUB HOUSING RCPT 36POS

135

1731070243

1731070243

Woodhead - Molex

FCT ML DSUB RCPT 2W2

0

1731090542

1731090542

Woodhead - Molex

FCT DSUB CRP PLG 15 PN W/CLINCH

0

1731130377

1731130377

Woodhead - Molex

CONN HOUSING

0

1731130183

1731130183

Woodhead - Molex

FCT HD DSUB CRP PLG 62PN

0

1731071799

1731071799

Woodhead - Molex

CONN HOUSING

0

1731090304

1731090304

Woodhead - Molex

FCT DSUB CRP RCPT 15 PN W/FLOAT

0

D-Sub, D-Shaped Connectors - Housings

1. Overview

D-Sub (D-subminiature) connectors and D-Shaped housings are metal-shelled electronics connectors characterized by their D-shaped mating interface. They ensure mechanical polarization and reliable signal/power transmission in critical applications. These components remain essential in industrial automation, telecommunications, and aerospace systems despite the rise of newer connector standards.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Standard D-Sub Housings9-104 contacts, 5-60A rating, basic EMI shieldingRS-232 serial ports, industrial control panels
High-Density HousingsDouble-deck contacts, 26-104 contactsTelecom backplanes, military data links
Waterproof HousingsIP67 rating, sealed mating interfacesMarine instrumentation, outdoor telecom cabinets
Right-Angle Housings90 PCB mount, space-saving designEmbedded industrial computers, test equipment

3. Structure & Composition

Typical D-Shaped housing consists of: - Metal Shell: Brass or zinc alloy with EMI/RFI shielding - Insulation Body: High-temperature resistant thermoplastic - Contact Arrangement: Multiple rows of signal/power pins - Mounting Features: Threaded inserts or panel clamps - Optional: Sealing gaskets, polarization keys

4. Key Technical Specifications

ParameterImportance
Current Rating (5-60A)Determines power transmission capacity
Contact Resistance ( 10m )Impacts signal integrity
Dielectric Strength (1000VAC)Ensures electrical safety
Operating Temperature (-55 C to +125 C)Defines environmental tolerance
Shielding Effectiveness (60-100dB)EMI/RFI protection level

5. Application Fields

  • Industrial Automation: PLCs, CNC machine controllers
  • Telecommunications: 4G/5G base stations, fiber optic equipment
  • Medical Equipment: Patient monitors, imaging systems
  • Aerospace: Avionics, flight control systems
  • Test & Measurement: Oscilloscopes, signal analyzers

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Features
AmphenolD38999 Series IIIMilitary-grade sealing, 100G vibration resistance
TE ConnectivityDEUTSCH DT SeriesHigh-density 96 contacts, quick-latch system
MolexMICRO D HDM Series0.050" contact spacing, 10Gbps data rate

7. Selection Guidelines

  1. Define current/voltage requirements
  2. Assess environmental conditions (temperature, moisture, vibration)
  3. Determine shielding needs for EMI-sensitive applications
  4. Choose mounting style (panel mount, PCB mount)
  5. Budget consideration: Cost varies 20-300% by performance tier

8. Industry Trends

Current development directions include: - Miniaturization: 0.025" contact pitch prototypes - High-speed capabilities: Differential pair designs for 25Gbps+ - Material innovation: Conductive polymers replacing metal shells - Environmental compliance: Halogen-free flame retardant materials - Smart integration: Embedded sensors for condition monitoring

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