D-Sub, D-Shaped Connectors - Housings

Image Part Number Description / PDF Quantity Rfq
121661-1001

121661-1001

VEAM

CONN MICRO-D HOUSING RCPT 9POS

0

DAA-3W3P-K87-F0

DAA-3W3P-K87-F0

VEAM

CONN D-SUB HOUSING PLUG 3POS

0

DBM5W5P0L4A191

DBM5W5P0L4A191

VEAM

CONN D-SUB HOUSING PLUG 5POS

0

DBM5W5S1A5NA190

DBM5W5S1A5NA190

VEAM

CONN D-SUB HOUSING RCPT 5POS

0

DAMT3W3S0L4A190A197

DAMT3W3S0L4A190A197

VEAM

CONN D-SUB HOUSING RCPT 3POS

0

DCMAM37PA173F0

DCMAM37PA173F0

VEAM

DSUB 37 M CRIMP G/COP ZINC

0

DBM5W5P1A5NA191

DBM5W5P1A5NA191

VEAM

CONN D-SUB HOUSING PLUG 5POS

0

DDMAME50PF0

DDMAME50PF0

VEAM

CONN D-SUB HOUSING PLUG 50POS

215

2DC-79SF172F0

2DC-79SF172F0

VEAM

CONN D-SUB HOUSING RCPT 79POS

0

2DD-100PF171F0

2DD-100PF171F0

VEAM

MICRO DD 100 PIN JACKP

0

2DEF-19P-F0

2DEF-19P-F0

VEAM

CONN D-SUB HOUSING PLUG 19POS

0

DBM5W5S1A9NA190

DBM5W5S1A9NA190

VEAM

CONN D-SUB HOUSING RCPT 5POS

0

DCMX8W8P0L4A191K87

DCMX8W8P0L4A191K87

VEAM

CONN D-SUB HOUSING PLUG 8POS

0

DBM5W5P0L4A190K87

DBM5W5P0L4A190K87

VEAM

CONN D-SUB HOUSING PLUG 5POS

0

DAMX3W3P0L4A190K87

DAMX3W3P0L4A190K87

VEAM

CONN D-SUB HOUSING PLUG 3POS

0

DAM3W3S1A7NA197

DAM3W3S1A7NA197

VEAM

CONN D-SUB HOUSING RCPT 3POS

0

DBM5W5P1A7NA190

DBM5W5P1A7NA190

VEAM

CONN D-SUB HOUSING PLUG 5POS

0

2DA-31SF171F0

2DA-31SF171F0

VEAM

MICRO 31 F JACKP ASS L/C

0

DCM8W8S0L4A191A197

DCM8W8S0L4A191A197

VEAM

CONN D-SUB HOUSING RCPT 8POS

0

DAMAK11W1PF0

DAMAK11W1PF0

VEAM

COMBO 11W1 M CRIMP FO ZINC

0

D-Sub, D-Shaped Connectors - Housings

1. Overview

D-Sub (D-subminiature) connectors and D-Shaped housings are metal-shelled electronics connectors characterized by their D-shaped mating interface. They ensure mechanical polarization and reliable signal/power transmission in critical applications. These components remain essential in industrial automation, telecommunications, and aerospace systems despite the rise of newer connector standards.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Standard D-Sub Housings9-104 contacts, 5-60A rating, basic EMI shieldingRS-232 serial ports, industrial control panels
High-Density HousingsDouble-deck contacts, 26-104 contactsTelecom backplanes, military data links
Waterproof HousingsIP67 rating, sealed mating interfacesMarine instrumentation, outdoor telecom cabinets
Right-Angle Housings90 PCB mount, space-saving designEmbedded industrial computers, test equipment

3. Structure & Composition

Typical D-Shaped housing consists of: - Metal Shell: Brass or zinc alloy with EMI/RFI shielding - Insulation Body: High-temperature resistant thermoplastic - Contact Arrangement: Multiple rows of signal/power pins - Mounting Features: Threaded inserts or panel clamps - Optional: Sealing gaskets, polarization keys

4. Key Technical Specifications

ParameterImportance
Current Rating (5-60A)Determines power transmission capacity
Contact Resistance ( 10m )Impacts signal integrity
Dielectric Strength (1000VAC)Ensures electrical safety
Operating Temperature (-55 C to +125 C)Defines environmental tolerance
Shielding Effectiveness (60-100dB)EMI/RFI protection level

5. Application Fields

  • Industrial Automation: PLCs, CNC machine controllers
  • Telecommunications: 4G/5G base stations, fiber optic equipment
  • Medical Equipment: Patient monitors, imaging systems
  • Aerospace: Avionics, flight control systems
  • Test & Measurement: Oscilloscopes, signal analyzers

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Features
AmphenolD38999 Series IIIMilitary-grade sealing, 100G vibration resistance
TE ConnectivityDEUTSCH DT SeriesHigh-density 96 contacts, quick-latch system
MolexMICRO D HDM Series0.050" contact spacing, 10Gbps data rate

7. Selection Guidelines

  1. Define current/voltage requirements
  2. Assess environmental conditions (temperature, moisture, vibration)
  3. Determine shielding needs for EMI-sensitive applications
  4. Choose mounting style (panel mount, PCB mount)
  5. Budget consideration: Cost varies 20-300% by performance tier

8. Industry Trends

Current development directions include: - Miniaturization: 0.025" contact pitch prototypes - High-speed capabilities: Differential pair designs for 25Gbps+ - Material innovation: Conductive polymers replacing metal shells - Environmental compliance: Halogen-free flame retardant materials - Smart integration: Embedded sensors for condition monitoring

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