D-Sub, D-Shaped Connectors

D-Sub, D-Shaped Connectors - Contacts

Part Number	Description / PDF	Quantity
86564610067LF Storage & Server IO (Amphenol ICC)	CONN D-SUB PIN 24-28AWG CRIMP	0
L17HRD2F015K Storage & Server IO (Amphenol ICC)	D SUB -REAR RELEASE CONTACTS	0
L17RRD1F0410K Storage & Server IO (Amphenol ICC)	DSUB SCKT RR RELEASE CNTCT	0
L17HRD2F115K Storage & Server IO (Amphenol ICC)	D SUB -REAR RELEASE CONTACTS	0
L17RRD1M0210K Storage & Server IO (Amphenol ICC)	DSUB PIN RR RELEASE CNTCT	0
L17RRD2M0110G Storage & Server IO (Amphenol ICC)	DSUB PIN RR RELEASE CNTCT	0
L17DM537432 Storage & Server IO (Amphenol ICC)	COMBO D-CONTACTS	0
L17HRD2M115G Storage & Server IO (Amphenol ICC)	D SUB -REAR RELEASE CONTACTS	0
L17HRD2F145G Storage & Server IO (Amphenol ICC)	D SUB -REAR RELEASE CONTACTS	0
SEMAFT09S Storage & Server IO (Amphenol ICC)	DM CRMP SOCKET CNR	0
8656450067LF Storage & Server IO (Amphenol ICC)	CONN D-SUB PIN 20-28AWG CRIMP	0
86564610065LF Storage & Server IO (Amphenol ICC)	CONN D-SUB PIN 24-28AWG CRIMP	0
86566510064LF Storage & Server IO (Amphenol ICC)	CONN D-SUB SOCKET 24-28AWG CRIMP	18800
86382000LF Storage & Server IO (Amphenol ICC)	CONN D-SUB PIN SLDR CUP GOLD	500
86566710064LF Storage & Server IO (Amphenol ICC)	CONN D-SUB SOCKET 24-28AWG CRIMP	0
L17DM537441C338 Storage & Server IO (Amphenol ICC)	COMBO D-CONTACTS	0
L17DM537405005 Storage & Server IO (Amphenol ICC)	COMBO D-CONTACTS	0
L17HRD2M1410K Storage & Server IO (Amphenol ICC)	D SUB -REAR RELEASE CONTACTS	0
L17DM5374020175 Storage & Server IO (Amphenol ICC)	COMBO D-CONTACTS	0
10090933-S2249LF Storage & Server IO (Amphenol ICC)	CONN D-SUB SOCKET	0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

Type	Function Features	Application Examples
DE-9	9-pin configuration, compact size	RS-232 serial interfaces, PC COM ports
DB-25	25-pin configuration, parallel signal transmission	Older printer ports, industrial control systems
DC-37	37-pin high-density arrangement	Military equipment, test instrumentation
HD D-Sub	High-density double-row contacts	Video graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

Parameter	Typical Range	Significance
Current Rating	1-5 A per contact	Determines power handling capacity
Voltage Rating	50-600 V AC/DC	Ensures dielectric strength
Contact Resistance	10 m	Impacts signal integrity
Insulation Resistance	1000 M	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Environmental durability

5. Application Fields

Computer peripherals (monitors, keyboards)
Industrial automation (PLCs, sensors)
Telecommunications (modems, routers)
Aerospace (avionics systems)
Test and measurement equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	DEUTSCH D-Sub series with EMI filtering
Amphenol	High-density HD D-Sub 90-position connectors
Molex	Micro D-Sub for compact industrial applications
Samtec	High-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

Verify current/voltage requirements against contact ratings
Choose shell size based on pin count needs
Consider locking mechanisms for vibration-prone environments
Specify plating material for corrosion resistance
Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.