D-Sub, D-Shaped Connectors

D-Sub, D-Shaped Connectors - Contacts

Image	Part Number	Description / PDF	Quantity	Rfq
	745931-8 TE Connectivity AMP Connectors	CONN D-SUB SOCKET 26-30AWG IDC	0
	211009-3 TE Connectivity AMP Connectors	SOCKET CONTACT POSTED SZ 22D	0
	166995-3 TE Connectivity AMP Connectors	CONN D-SUB PIN 28-32AWG CRIMP	0
	748333-9 TE Connectivity AMP Connectors	CONN D-SUB PIN 22-28AWG CRIMP	0
	166996-2 TE Connectivity AMP Connectors	CONN D-SUB SOCKET 28-32AWG CRIMP	0
	166996-3 TE Connectivity AMP Connectors	CONN D-SUB SOCKET 28-32AWG CRIMP	0
	349336-1 TE Connectivity AMP Connectors	CONN D-SUB PIN CRIMP GOLD	0
	745931-3 TE Connectivity AMP Connectors	CONTACT HDE SKT #1 30DP L/P	0
	166998-3 TE Connectivity AMP Connectors	CONN D-SUB SOCKET 28-32AWG CRIMP	0
	166997-3 TE Connectivity AMP Connectors	CONN D-SUB PIN 28-32AWG CRIMP	0
	1-745269-1 TE Connectivity AMP Connectors	CONN D-SUB SOCKET 22-26AWG CRIMP	0
	1-745266-0 TE Connectivity AMP Connectors	CONN D-SUB PIN 22-26AWG CRIMP	0
	748610-4 TE Connectivity AMP Connectors	CONN D-SUB SOCKET 22-28AWG CRIMP	0
	748333-7 TE Connectivity AMP Connectors	CONN D-SUB PIN 22-28AWG CRIMP	0
	748610-7 TE Connectivity AMP Connectors	CONN D-SUB SOCKET 22-28AWG CRIMP	0
	66556-3 TE Connectivity AMP Connectors	CONN D-SUB PIN 22-28AWG CRIMP	0
	745270-2 TE Connectivity AMP Connectors	CONN D-SUB SOCKET 18-22AWG CRIMP	0
	748333-4 TE Connectivity AMP Connectors	CONN D-SUB PIN 22-28AWG CRIMP	0
	166294-6 TE Connectivity AMP Connectors	CONN D-SUB PIN 24-28AWG CRIMP	0
	748333-2 TE Connectivity AMP Connectors	CONN D-SUB PIN 22-28AWG CRIMP	0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

Type	Function Features	Application Examples
DE-9	9-pin configuration, compact size	RS-232 serial interfaces, PC COM ports
DB-25	25-pin configuration, parallel signal transmission	Older printer ports, industrial control systems
DC-37	37-pin high-density arrangement	Military equipment, test instrumentation
HD D-Sub	High-density double-row contacts	Video graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

Parameter	Typical Range	Significance
Current Rating	1-5 A per contact	Determines power handling capacity
Voltage Rating	50-600 V AC/DC	Ensures dielectric strength
Contact Resistance	10 m	Impacts signal integrity
Insulation Resistance	1000 M	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Environmental durability

5. Application Fields

Computer peripherals (monitors, keyboards)
Industrial automation (PLCs, sensors)
Telecommunications (modems, routers)
Aerospace (avionics systems)
Test and measurement equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	DEUTSCH D-Sub series with EMI filtering
Amphenol	High-density HD D-Sub 90-position connectors
Molex	Micro D-Sub for compact industrial applications
Samtec	High-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

Verify current/voltage requirements against contact ratings
Choose shell size based on pin count needs
Consider locking mechanisms for vibration-prone environments
Specify plating material for corrosion resistance
Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.