D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120879

1731120879

Woodhead - Molex

FCT TERM HPWR

0

1731120783

1731120783

Woodhead - Molex

FCT TERM HFREQ

0

1731120780

1731120780

Woodhead - Molex

FCT TERM HFREQ

0

1731120546

1731120546

Woodhead - Molex

CONN RCPT FCT HDSIGN

0

1731120886

1731120886

Woodhead - Molex

FCT TERM HPWR

0

1731120812

1731120812

Woodhead - Molex

FCT TERM HFREQ

0

1731120153

1731120153

Woodhead - Molex

CONN D-SUB SCKT 8-12AWG SLDR CUP

0

1731120771

1731120771

Woodhead - Molex

FCT TERM HFREQ

0

1731120869

1731120869

Woodhead - Molex

FCT TERM HPWR

0

1731120767

1731120767

Woodhead - Molex

FCT TERM HFREQ

0

1731120943

1731120943

Woodhead - Molex

FCT TERM HFREQ

0

1731120846

1731120846

Woodhead - Molex

FCT TERM HPWR

0

1731120868

1731120868

Woodhead - Molex

FCT TERM HPWR

0

1731120915

1731120915

Woodhead - Molex

FCT TERM HPWR

0

1731120929

1731120929

Woodhead - Molex

FCT TERM HFREQ

0

1731121034

1731121034

Woodhead - Molex

FCT SIGN RCPT CRP 18-22AWG 8U" 5

0

1731120452

1731120452

Woodhead - Molex

FCT TERM HFREQ CRP PLG 50 OHM DI

0

1731120865

1731120865

Woodhead - Molex

FCT TERM HPWR

0

1731120940

1731120940

Woodhead - Molex

FCT TERM HFREQ

0

1731120468

1731120468

Woodhead - Molex

D-SUB COAXIAL CRIMP/CRIMP

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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