D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1727040133

1727040133

Woodhead - Molex

CONN D-SUB SOCKET COAX GOLD

0

1731120139

1731120139

Woodhead - Molex

CONN D-SUB SOCKET HOSE/TUBING

100100

1731120203

1731120203

Woodhead - Molex

CONN D-SUB PIN 18-22AWG CRIMP

2

1727040187

1727040187

Woodhead - Molex

CONN D-SUB PIN 8-12AWG SLDR CUP

400

1731120210

1731120210

Woodhead - Molex

CONN D-SUB SOCKET 20-24AWG CRIMP

4355

1731120221

1731120221

Woodhead - Molex

CONN D-SUB SOCKET 26-28AWG CRIMP

500

1731120389

1731120389

Woodhead - Molex

FCT TERM HPWR RA PC PLG 20 AMP D

100

1727040190

1727040190

Woodhead - Molex

CONN D-SUB SOCKET PCB GOLD

200

1731120136

1731120136

Woodhead - Molex

CONN D-SUB PIN HOSE/TUBING

36

1731120086

1731120086

Woodhead - Molex

CONN D-SUB SOCKET PCB GOLD

0

1731120430

1731120430

Woodhead - Molex

FCT TERM SIGN STAMPED PLG CRP 20

2500

1731120859

1731120859

Woodhead - Molex

FCT TERM HPWR

200

1731120213

1731120213

Woodhead - Molex

CONN D-SUB SOCKET 26-28AWG CRIMP

320

1731120043

1731120043

Woodhead - Molex

CONN D-SUB SCKT 8-12AWG SLDR CUP

0

1731120741

1731120741

Woodhead - Molex

'FCT HD SIGN PLG CRP 22-28AWG 50

1000

1731120465

1731120465

Woodhead - Molex

COAX CRIMP CONTACT 50 OHM

73

1731120419

1731120419

Woodhead - Molex

FCT TERM HFREQ CRP RCPT 50 OHM

300

1731120084

1731120084

Woodhead - Molex

CONN D-SUB SOCKET PCB GOLD

0

1731120085

1731120085

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

195

1731120052

1731120052

Woodhead - Molex

CONN D-SUB PIN COAX CRIMP GOLD

90

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

RFQ BOM Call Skype Email
Top