D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120488

1731120488

Woodhead - Molex

FCT TERM SIGN STAMPED PLG CRP 26

701700

031-1007-048

031-1007-048

VEAM

CONN D-SUB SOCKET 26-30AWG CRIMP

11620

09692817230

09692817230

HARTING

D SUB MIXED MA S CRIMP COAX 75 H

19

7918-PIN-M-10K

7918-PIN-M-10K

Oupiin

HD D-SUB CRIMP TYPE PINS, MALE,

1000

1599600

1599600

Phoenix Contact

CONN D-SUB SOCKET CRIMP GOLD

2048

206793-1

206793-1

TE Connectivity Aerospace Defense and Marine

CONN D-SUB SOCKET 20-24AWG CRIMP

957

207683-6

207683-6

TE Connectivity Aerospace Defense and Marine

CONN PIN D-SUB CONTACT SIZE 22

0

1731121747

1731121747

Woodhead - Molex

HAND TOOL FCT MCD

2

1731120145

1731120145

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

39

DM53740-15

DM53740-15

VEAM

CONN D-SUB PIN COAX CABLE CRIMP

208

09692825422

09692825422

HARTING

CONN D-SUB PIN 10-12AWG CRIMP

0

09692815421

09692815421

HARTING

CONN D-SUB PIN SLDR CUP GOLD

16

1727040157

1727040157

Woodhead - Molex

CONN D-SUB SOCKET 10-12AWG CRIMP

100

DM537458

DM537458

VEAM

CONN D-SUB PIN 16AWG SLDR CUP

673

09692815141

09692815141

HARTING

CONN D-SUB PIN COAXIAL CABLE

15

1731120223

1731120223

Woodhead - Molex

CONN D-SUB PIN 24-28AWG CRIMP

0

DM1303411

DM1303411

VEAM

CONN D-SUB SOCKET 8AWG CRIMP

932

1731120163

1731120163

Woodhead - Molex

CONN D-SUB SOCKET PCB GOLD

100

132A11019X

132A11019X

CONEC

CONN D-SUB SOCKET 16-20AWG CRIMP

1297

1731120030

1731120030

Woodhead - Molex

CONN D-SUB PIN 20AWG SLDR CUP

106400

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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