D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
211009-1

211009-1

TE Connectivity AMP Connectors

SOCK CONT POSTED SIZE 22D

0

09670008238

09670008238

HARTING

DSUB FE-CR-KON AWG20-24 AFS2;RR1

0

L17RRD2M0410G

L17RRD2M0410G

Storage & Server IO (Amphenol ICC)

DSUB PIN RR RELEASE CNTCT

0

L17DM53744204

L17DM53744204

Storage & Server IO (Amphenol ICC)

COMBO D-CONTACTS

0

131A13049X

131A13049X

CONEC

CONTACT PIN MALE R/A

0

1731120186

1731120186

Woodhead - Molex

CONN D-SUB PIN COAX CRIMP GOLD

0

DM130340-4

DM130340-4

VEAM

CONN D-SUB PIN 16AWG CRIMP GOLD

12760

030-50770-31

030-50770-31

JAE Electronics

CONN CONTACT

0

131A16049X

131A16049X

CONEC

MALE R/A 40A FOR CRIMP/SOLDER

0

L17RRD2M14100

L17RRD2M14100

Storage & Server IO (Amphenol ICC)

DSUB PIN RR RELEASE CNTCT

0

09670003572

09670003572

HARTING

D SUB MA TURNED CONTACT AWG 18-2

0

0830009560

0830009560

Woodhead - Molex

CONN D-SUB PIN 28AWG CRIMP GOLD

144532000

09692845100

09692845100

HARTING

D SUB MA 50 OHMS PCB SOLDER CONT

0

8656353065LF

8656353065LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB SCKT 20-24AWG CRIMP

0

1731120319

1731120319

Woodhead - Molex

CONN D-SUB SOCKET 20-24AWG CRIMP

0

1731120901

1731120901

Woodhead - Molex

FCT TERM HPWR

0

1731120177

1731120177

Woodhead - Molex

CONN D-SUB SOCKET COAX GOLD

0

748610-8

748610-8

TE Connectivity AMP Connectors

CONN D-SUB SOCKET 22-28AWG CRIMP

0

445798-1

445798-1

TE Connectivity Aerospace Defense and Marine

CONN D-SUB SOCKET SLDR GOLD

0

330-8515-101

330-8515-101

VEAM

DSUB CON 12PIN F80 LMFB A36

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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