Contacts, Spring Loaded (Pogo Pins), and Pressure

Image Part Number Description / PDF Quantity Rfq
2430

2430

Adafruit

CONTACT SPRING LOADED SMD 10PC

0

90203-AS

90203-AS

Preci-Dip

CONTACT SPRING LOADED SMD GOLD

0

H038DL3A-1C

H038DL3A-1C

Plastronics Sockets & Connectors

SPRING PROBE .38X3.86MM 1=100PCS

200

0922-0-15-20-75-14-11-0

0922-0-15-20-75-14-11-0

Mill-Max

CONTACT SPRING LOADED T/H GOLD

10190

0913-0-15-20-77-14-11-0

0913-0-15-20-77-14-11-0

Mill-Max

CONTACT SPRING LOADED SMD GOLD

14335

H077LL1A-1C

H077LL1A-1C

Plastronics Sockets & Connectors

SPRING PROBE .77MM X 4.45MM HPIN

200

0997-7-50-20-75-14-11-0

0997-7-50-20-75-14-11-0

Mill-Max

CONTACT SPRING LOADED SMD GOLD

0

H100LL1A-1C

H100LL1A-1C

Plastronics Sockets & Connectors

SPRING PROBE 1.0MM X 10.3MM HPIN

200

H027LL1A-1C

H027LL1A-1C

Plastronics Sockets & Connectors

SPRING PROBE .27MM X 2.89MM HPIN

200

A-CSL-S-020-B6

A-CSL-S-020-B6

ASSMANN WSW Components

CONN PIN SPRING LOAD 6.629MM AU

1810

7982-1-15-20-75-14-11-0

7982-1-15-20-75-14-11-0

Mill-Max

SPRING-LOADED PIN WITH A STANDAR

3802

806-22-001-30-004191

806-22-001-30-004191

Mill-Max

CONTACT SPRING LOADED SMD GOLD

3107

0997-5-50-20-75-14-11-0

0997-5-50-20-75-14-11-0

Mill-Max

CONTACT SPRING LOADED SMD GOLD

1428

806-22-001-30-003191

806-22-001-30-003191

Mill-Max

CONTACT SPRING LOADED SMD GOLD

60853

0956-0-15-20-75-14-11-0

0956-0-15-20-75-14-11-0

Mill-Max

CONTACT SPRING LOADED T/H GOLD

3842

0990-2-50-20-75-14-11-0

0990-2-50-20-75-14-11-0

Mill-Max

CONTACT SPRING LOADED SMD GOLD

4004

H038DL1A-1C

H038DL1A-1C

Plastronics Sockets & Connectors

SPRING PROBE .38X3.86MM 1=100PCS

200

90150-AS

90150-AS

Preci-Dip

CONTACT SPRING LOADED SMD GOLD

0

90024-AS

90024-AS

Preci-Dip

CONTACT SPRING LOADED SMD GOLD

41125

806-22-001-30-012191

806-22-001-30-012191

Mill-Max

CONTACT SPRING LOADED SMD GOLD

708

Contacts, Spring Loaded (Pogo Pins), and Pressure

1. Overview

Connectors and interconnect contacts are critical components enabling electrical and mechanical connections in electronic systems. Spring-loaded contacts (Pogo Pins) utilize a compressible spring mechanism to maintain stable contact force under pressure, ensuring reliable signal and power transmission. These components are fundamental in applications ranging from consumer electronics to aerospace systems, where durability and performance under dynamic conditions are essential.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Standard Pogo PinsGeneral-purpose design with moderate current capacitySmartphone battery connectors
High-Current Pogo PinsLarge diameter and low-resistance materialsElectric vehicle charging interfaces
High-Frequency Pogo PinsControlled impedance and minimized inductance5G base station testing equipment
Microminiature Pogo PinsDiameter <1.0mm for compact designsWearable medical devices

3. Structure and Components

A typical spring-loaded contact consists of three main components: (1) Plunger with hard gold-plated tip for low contact resistance, (2) Spring providing axial compression force (typically phosphor bronze or beryllium copper), and (3) Outer barrel with threaded or press-fit mounting options. Advanced designs incorporate anti-rotation features and multi-stage springs for shock absorption. Contact surfaces often use ruthenium or diamond-like carbon coatings for extended wear resistance.

4. Key Technical Parameters

ParameterSignificanceTypical Range
Current RatingDetermines power transmission capacity0.5A-50A
Contact ForceAffects connection stability0.1N-20N
ImpedanceCritical for high-speed signal integrity5-100m
Operating LifeNumber of mating cycles100,000-5,000,000 cycles
Withstanding VoltageSafety and insulation performance50V-1000V

5. Application Fields

Primary industries include:

  • Consumer Electronics: Automated test equipment (ATE), foldable device hinges
  • Automotive: Battery management systems, autonomous driving sensor connectors
  • Medical: Disposable endoscope interfaces, patient monitoring devices
  • Industrial: Robotic arm connectors, CNC machine tool probes
  • Aerospace: Satellite deployment mechanisms, avionics maintenance interfaces

6. Leading Manufacturers and Products

ManufacturerKey ProductsSpecialization
SamtecSEAM Series Micro Pogo PinsHigh-density PCB interconnects
MolexPreci-Flex ContactsHigh-reliability automotive solutions
Everett CharlesEC Series High-Current ProbesSemiconductor testing applications
Ottawa IndustriesHyperboloid ContactsMilitary/aerospace connectors

7. Selection Guidelines

Key considerations include:

  1. Current/voltage requirements vs. contact resistance
  2. Operating environment (temperature, vibration, contamination)
  3. Mating cycle expectations and wear resistance
  4. Size constraints and alignment tolerance
  5. Cost vs. reliability trade-offs
For example, selecting 304 stainless steel springs for corrosion resistance in outdoor medical equipment, or choosing gold-over-nickel plating for low-voltage biomedical sensors.

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-0.5mm diameter contacts for AR/VR devices
  • High-frequency optimization: Gbps+ data rates for 6G testing
  • Smart materials: Shape-memory alloys for self-adjusting contacts
  • Integrated sensors: Built-in force/temperature monitoring
  • Environmental sustainability: Lead-free plating and recyclable materials
The global market is projected to grow at 7.2% CAGR through 2030, driven by EV charging infrastructure and IoT device expansion.

RFQ BOM Call Skype Email
Top