Contacts - Multi Purpose

Image Part Number Description / PDF Quantity Rfq
SM20M-1S6

SM20M-1S6

Souriau-Sunbank by Eaton

CONN PIN 20-22AWG GOLD CRIMP

3375

SM20M1D70REV

SM20M1D70REV

Souriau-Sunbank by Eaton

CONN PIN 20-22AWG GOLD CRIMP

0

RM20M12T

RM20M12T

Souriau-Sunbank by Eaton

CONTACT PIN CRIMP 20-22AWG TIN

0

RC14M30D28

RC14M30D28

Souriau-Sunbank by Eaton

CONN SOCKET 14AWG GOLD CRIMP

0

RC16M23N

RC16M23N

Souriau-Sunbank by Eaton

CONN SOCKET 16-20AWG GOLD CRIMP

0

RMDX60-2D28

RMDX60-2D28

Souriau-Sunbank by Eaton

SUBMIN COAX OUTER BODY,M

0

SC20M1D70REV

SC20M1D70REV

Souriau-Sunbank by Eaton

CONN SOCKET 20-22AWG GOLD CRIMP

0

SC14M1D70

SC14M1D70

Souriau-Sunbank by Eaton

CONN SOCKET 14AWG GOLD CRIMP

0

RMDX60-31D28

RMDX60-31D28

Souriau-Sunbank by Eaton

CONN SCKT COAX 26AWG GOLD CRIMP

0

RM14M10GE00K

RM14M10GE00K

Souriau-Sunbank by Eaton

CONN PIN 14AWG GOLD CRIMP

0

RCDX60-52D28

RCDX60-52D28

Souriau-Sunbank by Eaton

CONN PIN COAX GOLD CRIMP

0

RFD26L-1D28

RFD26L-1D28

Souriau-Sunbank by Eaton

SUBMIN COAX INNER FEMALE

0

RC20M12D281000

RC20M12D281000

Souriau-Sunbank by Eaton

CONN SOCKET 20-22AWG GOLD CRIMP

0

SM16M11S6REV

SM16M11S6REV

Souriau-Sunbank by Eaton

CONN PIN 16-18AWG GOLD CRIMP

0

ETH1-1503A

ETH1-1503A

Souriau-Sunbank by Eaton

CONN PIN 22-26AWG GOLD CRIMP

0

RM20M12G8D28

RM20M12G8D28

Souriau-Sunbank by Eaton

CONN PIN 20-22AWG GOLD SOLDER

1000

ETH1-1504A

ETH1-1504A

Souriau-Sunbank by Eaton

CONN SOCKET 22-26AWG GOLD CRIMP

0

RMDX60-24D28

RMDX60-24D28

Souriau-Sunbank by Eaton

CONN SCKT COAX 26AWG GOLD CRIMP

0

RC16M-23T

RC16M-23T

Souriau-Sunbank by Eaton

CONN SOCKET 16-20AWG TIN CRIMP

398

SC16M11S6REV

SC16M11S6REV

Souriau-Sunbank by Eaton

STRIP HYFEN SOCKET

0

Contacts - Multi Purpose

1. Overview

Multi-purpose connectors and interconnects contacts are modular electronic components designed to establish reliable electrical connections across diverse applications. These devices enable signal, data, or power transmission between subsystems or devices. Their versatility, miniaturization, and high-performance characteristics make them critical in modern electronics, automotive systems, industrial machinery, and communication infrastructure.

2. Main Types & Functional Classification

TypeKey FeaturesApplication Examples
USB ConnectorsHot-pluggable, reversible design, supports high-speed data/powerSmartphones, PCs, peripheral devices
HDMI ConnectorsHigh-bandwidth digital audio/video transmissionTVs, monitors, AV equipment
RJ45 ConnectorsStandardized Ethernet interfacesNetwork routers, switches
DIN ConnectorsCircular design with multiple pin configurationsIndustrial control systems
IEC ConnectorsStandardized power interfacesMedical devices, test equipment

3. Structure & Components

Typical structure includes:

  • Contacts: Conductive elements (e.g., copper alloys with gold plating)
  • Insulator: Dielectric housing (LCP, PBT, or nylon)
  • Shielding: EMI protection layers
  • Actuation Mechanism: Latches or screw locks
Advanced designs integrate features like anti-vibration locking and thermal management coatings.

4. Key Technical Specifications

ParameterImportance
Current Rating (A)Determines power handling capacity
Contact Resistance (m )Affects signal integrity
Dielectric Withstanding Voltage (V)Ensures electrical safety
Insertion Force (N)Impacts usability and durability
Mating CyclesDefines service life expectancy

5. Application Fields

Major industries include:

  • Consumer Electronics: Smartphones, laptops
  • Industrial Automation: PLCs, sensors
  • Telecommunications: 5G base stations
  • Medical Devices: MRI machines, patient monitors
  • Automotive: EV charging systems, ADAS

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
TE ConnectivityNanoMQS automotive connectors
MolexMX150 sealed connectors
AmphenolUSB4 Type-C receptacles
SamtecQSE high-speed backplane connectors
DelphiCompactTAS automotive interconnects

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current)
  • Environmental conditions (temperature, vibration)
  • Compliance standards (RoHS, REACH)
  • Space constraints and mounting type
  • Total lifecycle cost analysis

8. Industry Trends

Emerging developments:

  • Miniaturization for IoT and wearable devices
  • High-speed protocols (USB4, Thunderbolt 4)
  • Smart connectors with integrated sensors
  • Increased adoption of hybrid optical-electrical interfaces
  • RoHS-compliant materials and recycling programs

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