| Image | Part Number | Description / PDF | Quantity | Rfq |
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TE Connectivity AMP Connectors |
SIL CONTACT Y1 THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
DIL CONTACT F1 THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
SIL CONTACT Y1 THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
DIL CONTACT F1 THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
SIL CONTACT Y1 THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
SIL CONTACT THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
DIL CONTACT G1 THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
SIL CONTACT THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
SIL CONTACT THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
DIL CONTACT F1 THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
DIL CONTACT G1 THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
DIL CONTACT F1 THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
SIL CONTACT THROUGH HOLE |
0 |
|
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TE Connectivity AMP Connectors |
DIL CONTACT F1 THROUGH HOLE |
0 |
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TE Connectivity AMP Connectors |
SIL CONTACT THROUGH HOLE |
0 |
|
|
TE Connectivity AMP Connectors |
DIL CONTACT F1 THROUGH HOLE |
0 |
|
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TE Connectivity AMP Connectors |
SIL CONTACT Y1 THROUGH HOLE |
0 |
|
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TE Connectivity AMP Connectors |
SIL CONTACT THROUGH HOLE |
0 |
|
|
TE Connectivity AMP Connectors |
SIL CONTACT Y1 THROUGH HOLE |
0 |
|
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TE Connectivity AMP Connectors |
SIL CONTACT Y1 THROUGH HOLE |
0 |
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Leadframe-based connectors and interconnects contacts are critical components in electronic packaging systems. A leadframe serves as the foundation for semiconductor device packaging, providing electrical connectivity between the integrated circuit (IC) die and external circuits. These components enable signal transmission, power distribution, and mechanical support in modern electronics, playing a vital role in miniaturization, thermal management, and reliability of advanced semiconductor devices.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Dual Inline Leadframe (DIL) | Parallel row pin configuration, cost-effective packaging | Memory modules, logic ICs |
| Quad Flat No-leads (QFN) | Bottom-exposed pad for thermal dissipation, low profile | Mobile devices, RF transceivers |
| Power Leadframe | Thick copper alloys for high current capacity | Power MOSFETs, automotive sensors |
| Stacked Die Leadframe | Multi-tier design for 3D packaging integration | High-density memory stacks |
A typical leadframe assembly consists of: - Base Material: Copper alloys (C194, C151) or iron-nickel (FeNi42) for thermal/electrical performance - Plating Layers: Silver, gold, or tin coatings for corrosion resistance and solderability - Lead Configuration: Gull-wing, J-bend, or flat contacts with pitch sizes down to 0.4mm - Die Pad: Central mounting platform with thermal vias for heat dissipation - Encapsulation Interface: Mold compound adhesion features for package integrity
| Parameter | Typical Range | Importance |
|---|---|---|
| Contact Resistance | 5-50 m | Impacts signal integrity and power loss |
| Current Capacity | 0.5-20 A/pin | Determines power handling capability |
| Thermal Resistance | 2-15 C/W | Crucial for high-power device reliability |
| Dimensional Tolerance | 1-5 m | Enables precise PCB alignment |
| Operating Temperature | -55 C to 260 C | Defines application environment limits |
Key industries utilizing leadframe technology include: - Consumer Electronics: Smartphones (camera module connectors), laptops - Automotive: ADAS sensors, battery management systems - Industrial: Motor controllers, PLC systems - Telecommunications: 5G base station RF modules - Medical: Implantable devices, diagnostic equipment
| Manufacturer | Representative Products |
|---|---|
| Amphenol Corporation | Hermetic leadframes for aerospace applications |
| TE Connectivity | MicroSpeed QFN leadframes |
| Molex (Koch) | PowerBlade+ leadframe technology |
| Standex Electronics | Custom precious metal leadframes |
Key considerations for leadframe selection: - Electrical requirements (current density, frequency characteristics) - Thermal management needs (power dissipation, CTE matching) - Spatial constraints (pitch size, package height) - Environmental factors (corrosion resistance, temperature range) - Cost-efficiency balance for volume production - Compliance with RoHS/REACH regulations
Emerging developments include: - Advanced Packaging: Transition to 2.5D/3D IC integration requiring TSV-compatible leadframes - Materials Innovation: Graphene-coated composites for enhanced thermal conductivity - Miniaturization: Sub-0.3mm pitch leadframes for wearable devices - Automotive Focus: AEC-Q qualified leadframes for electric vehicle power modules - Sustainability: Development of lead-free plating processes and recyclable materials