| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Woodhead - Molex |
CONN EDGE DUAL FMALE 226POS .030 |
4 |
|
 |
Woodhead - Molex |
EDGELINESLIVER ASSY VT SMT 140PO |
0 |
|
 |
Woodhead - Molex |
CONN EDGE DUAL FMALE 98POS 0.039 |
257 |
|
 |
Woodhead - Molex |
CONN PCI EXP FEMALE 36POS 0.039 |
0 |
|
 |
Woodhead - Molex |
CONN PCI EXP FEMALE 230POS 0.039 |
1061 |
|
 |
Woodhead - Molex |
CONN PCI EXP FEMALE 36POS 0.039 |
1416 |
|
 |
Woodhead - Molex |
CONN PCI EXP FEMALE 64POS 0.039 |
3027 |
|
 |
Woodhead - Molex |
CONN PCI EXP MINI FEMALE 52POS |
6670 |
|
 |
Woodhead - Molex |
CONN EDGE DUAL FEMALE 4POS 0.508 |
4 |
|
 |
Woodhead - Molex |
CONN EDGE DUAL FMALE 164POS .039 |
257 |
|
 |
Woodhead - Molex |
CONN EDGE DUAL FMALE 18POS 0.508 |
0 |
|
|
Woodhead - Molex |
CONN EDGE DUAL FMALE 170POS .031 |
0 |
|
|
Woodhead - Molex |
CONN EDGE DUAL FMALE 14POS 0.508 |
0 |
|
|
Woodhead - Molex |
CONN EDGE DUAL FMALE 20POS 0.508 |
0 |
|
|
Woodhead - Molex |
CONN EDGE DUAL FMALE 108POS .031 |
0 |
|
|
Woodhead - Molex |
CONN EDGE DUAL FMALE 278POS .031 |
0 |
|
|
Woodhead - Molex |
CONN AMC B+ FEMALE 170POS 0.029 |
0 |
|
|
Woodhead - Molex |
CONN EDGE DUAL FMALE 170POS .030 |
0 |
|
|
Woodhead - Molex |
CONN EDGE DUAL FMALE 12POS 0.508 |
0 |
|
|
Woodhead - Molex |
EDGELINE SLIVER ASSY 4C+ VT SMT |
0 |
|
Card Edge Connectors, also known as Edgeboard Connectors, are electrical connectors designed to connect printed circuit boards (PCBs) directly to other boards or systems via their edges. These connectors eliminate the need for separate cables or wiring harnesses by utilizing the PCB's edge as both the mechanical support and electrical interface. They play a critical role in modern electronics by enabling compact designs, reliable signal transmission, and modular system architectures.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| PCIe Edge Connectors | High-speed serial communication with low latency | Graphics cards, SSDs, network adapters |
| DIMM Connectors | Parallel data transfer for memory modules | Desktop/server RAM modules |
| SATA Edge Connectors | Serial data transfer with hot-swapping capability | HDDs, SSDs, optical drives |
| USB Type-C Edge Connectors | Bidirectional 24-pin configuration with power delivery | Laptops, mobile devices, docking stations |
Typical card edge connectors consist of: - Contact Points: Phosphor bronze or beryllium copper with gold-plated surfaces (10-50 m thickness) for low resistance - Insulation Body: High-temperature resistant LCP or nylon materials (UL94 V-0 rated) - Retention Mechanism: Integrated latches or screws for vibration resistance - PCB Interface: Precision-machined slots with alignment guides ( 0.05mm tolerance) - Shielding Layer: EMI-suppressing metal shells for high-frequency applications
| Parameter | Typical Value | Importance |
|---|---|---|
| Contact Resistance | 5-20m | Ensures minimal signal loss |
| Current Rating | 1-5A per contact | Determines power delivery capacity |
| Dielectric Withstanding Voltage | 500-1000V AC | Guarantees electrical safety |
| Insertion Force | 20-60N | Affects user experience and durability |
| Operating Temperature | -55 C to +125 C | Defines environmental adaptability |
| Mating Cycles | 500-10,000 cycles | Measures mechanical longevity |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Amphenol ICC | SmartSpring PCIe Gen5 | 7GHz bandwidth, 0.3mm pitch |
| TE Connectivity | MEZZOP Edge Connector | Double-sided contact design |
| Molex | SL Series DIMM | 2.0N contact force reduction |
| Samtec | Edge Rate HD | 0.8mm pitch, 25Gbps per channel |
Key considerations include: - Signal integrity requirements (frequency vs. crosstalk) - Mechanical constraints (board thickness, spacing) - Environmental conditions (temperature, vibration) - Compliance standards (IPC, RoHS) - Cost-performance balance (gold thickness vs. mating cycles) - Example: For a 10Gbps Ethernet switch, select connectors with controlled impedance (100 10%) and low insertion loss (<0.5dB at 12.5GHz)
Current development directions: - High-density designs (sub-0.5mm pitch) - Enhanced thermal management for 5G applications - Integration with optical interconnects - Surface-mount technology (SMT) adoption - Increased use of conductive polymers for contact materials - Development of self-aligning connectors for automated assembly