Card Edge Connectors - Edgeboard Connectors

Part Number	Description / PDF	Quantity
PEC-03-02-T-S-LC Samtec, Inc.	CONN EDGE CARD .100"	81
MEC1-120-02-L-D-A-K-TR Samtec, Inc.	CONN EDGE DUAL FMALE 40POS 0.039	195
MEC8-140-02-S-DV-TR Samtec, Inc.	CONN EDGE DUAL FMALE 80POS 0.031	0
MEC2-05-01-L-TH1-WT Samtec, Inc.	2.00 MM MINI EDGE CARD CONNECTOR	23
MEC1-105-02-S-D-A Samtec, Inc.	CONN EDGE DUAL FMALE 10POS 0.039	33
MEC8-120-02-L-DV-A-TR Samtec, Inc.	CONN EDGE DUAL FMALE 40POS 0.031	0
MEC8-170-01-L-DV-A-K Samtec, Inc.	CONN EDGE DUAL FMALE 140P 0.031	0
PCIE-064-02-F-D-TH Samtec, Inc.	CONN PCI EXP FMALE 64POS 0.039	1441
MEC6-120-02-L-DV-A-K Samtec, Inc.	CONN EDGE DUAL FMALE 40POS 0.025	0
MEC8-110-01-L-DV-A Samtec, Inc.	CONN EDGE DUAL FMALE 20POS 0.031	0
MEC1-108-02-F-D-A-TR Samtec, Inc.	CONN EDGE DUAL FMALE 16POS 0.039	0
HSEC8-110-01-S-RA-TR Samtec, Inc.	CONN EDGE DUAL FMALE 20POS 0.031	243
MEC8-120-01-S-DV-A Samtec, Inc.	CONN EDGE DUAL FMALE 40POS 0.031	0
MEC8-120-01-L-DV-A-K-TR Samtec, Inc.	CONN EDGE DUAL FMALE 40POS 0.031	0
MEC8-120-01-L-DV-LC-TR Samtec, Inc.	CONN EDGE DUAL FMALE 40POS 0.031	0
MEC1-160-02-L-D-A Samtec, Inc.	CONN EDGE DUAL FMALE 120P 0.039	16
HSEC8-110-01-S-DV-A-K-TR Samtec, Inc.	CONN EDGE DUAL FMALE 20POS 0.031	532
HSEC8-125-01-S-DV-A-K-TR Samtec, Inc.	CONN EDGE DUAL FMALE 50POS 0.031	336
MEC8-145-02-L-DV-A-K Samtec, Inc.	CONN EDGE DUAL FMALE 90POS 0.031	0
MEC8-120-02-L-DV-LC Samtec, Inc.	CONN EDGE DUAL FMALE 40POS 0.031	0

Card Edge Connectors - Edgeboard Connectors

1. Overview

Card Edge Connectors, also known as Edgeboard Connectors, are electrical connectors designed to connect printed circuit boards (PCBs) directly to other boards or systems via their edges. These connectors eliminate the need for separate cables or wiring harnesses by utilizing the PCB's edge as both the mechanical support and electrical interface. They play a critical role in modern electronics by enabling compact designs, reliable signal transmission, and modular system architectures.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
PCIe Edge Connectors	High-speed serial communication with low latency	Graphics cards, SSDs, network adapters
DIMM Connectors	Parallel data transfer for memory modules	Desktop/server RAM modules
SATA Edge Connectors	Serial data transfer with hot-swapping capability	HDDs, SSDs, optical drives
USB Type-C Edge Connectors	Bidirectional 24-pin configuration with power delivery	Laptops, mobile devices, docking stations

3. Structure and Components

Typical card edge connectors consist of: - Contact Points: Phosphor bronze or beryllium copper with gold-plated surfaces (10-50 m thickness) for low resistance - Insulation Body: High-temperature resistant LCP or nylon materials (UL94 V-0 rated) - Retention Mechanism: Integrated latches or screws for vibration resistance - PCB Interface: Precision-machined slots with alignment guides ( 0.05mm tolerance) - Shielding Layer: EMI-suppressing metal shells for high-frequency applications

4. Key Technical Specifications

Parameter	Typical Value	Importance
Contact Resistance	5-20m	Ensures minimal signal loss
Current Rating	1-5A per contact	Determines power delivery capacity
Dielectric Withstanding Voltage	500-1000V AC	Guarantees electrical safety
Insertion Force	20-60N	Affects user experience and durability
Operating Temperature	-55 C to +125 C	Defines environmental adaptability
Mating Cycles	500-10,000 cycles	Measures mechanical longevity

5. Application Fields

Computer Systems: Motherboards, expansion cards, memory modules
Telecommunications: 5G base stations, network switches
Industrial Automation: PLCs, control panels
Medical Equipment: MRI scanners, diagnostic devices
Consumer Electronics: Smartphones, gaming consoles

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Amphenol ICC	SmartSpring PCIe Gen5	7GHz bandwidth, 0.3mm pitch
TE Connectivity	MEZZOP Edge Connector	Double-sided contact design
Molex	SL Series DIMM	2.0N contact force reduction
Samtec	Edge Rate HD	0.8mm pitch, 25Gbps per channel

7. Selection Guidelines

Key considerations include: - Signal integrity requirements (frequency vs. crosstalk) - Mechanical constraints (board thickness, spacing) - Environmental conditions (temperature, vibration) - Compliance standards (IPC, RoHS) - Cost-performance balance (gold thickness vs. mating cycles) - Example: For a 10Gbps Ethernet switch, select connectors with controlled impedance (100 10%) and low insertion loss (<0.5dB at 12.5GHz)

8. Industry Trends

Current development directions: - High-density designs (sub-0.5mm pitch) - Enhanced thermal management for 5G applications - Integration with optical interconnects - Surface-mount technology (SMT) adoption - Increased use of conductive polymers for contact materials - Development of self-aligning connectors for automated assembly