Card Edge Connectors - Adapters

Image Part Number Description / PDF Quantity Rfq
292204-3

292204-3

TE Connectivity AMP Connectors

CONN EDGE ADAPT CARD-HDR 8POS

0

292204-2

292204-2

TE Connectivity AMP Connectors

CONN EDGE ADAPT CARD-HDR 8POS

0

Card Edge Connectors - Adapters

1. Overview

Card Edge Connectors - Adapters are hybrid solutions combining printed circuit board (PCB) edge connectors with interface conversion capabilities. They enable direct board-to-board connections while facilitating protocol, form factor, or signal standard transitions. These components are critical in modern electronics for expanding functionality, enabling modular designs, and ensuring compatibility across generations of hardware architectures.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
PCIe Expansion AdaptersHigh-speed protocol conversion (e.g., PCIe Gen4 to NVMe)SSD storage expansion cards
Hybrid Memory AdaptersDRAM standard conversion (e.g., SODIMM to microDIMM)Industrial computer upgrades
IO Interface ConvertersPhysical layer translation (e.g., SATA to M.2)Embedded system integration
High-Speed MezzanineParallel bus to serial protocol conversionTelecom backplane systems

3. Structure & Components

Typical construction includes:

  • Stamped contact elements (phosphor bronze with gold plating)
  • High-temperature thermoplastic insulation (LCP or nylon 6T)
  • Anti-vibration polarization keying systems
  • EMI shielding cages (optional)
  • PCB mounting guides with compliance features

Advanced designs integrate signal conditioning ICs for high-speed applications.

4. Key Technical Specifications

ParameterTypical RangeCritical Importance
Insertion Force30-80NDirectly impacts connector longevity
Contact Resistance5-20m Signal integrity maintenance
DWV Rating500VACSafety and reliability assurance
Bit Rate0.5-32GbpsDefines application suitability
Mating Cycles500-10,000Product lifecycle determination

5. Application Fields

Primary use in:

  • Consumer Electronics: Laptop memory expansion
  • Industrial Automation: PLC modular I/O systems
  • Telecommunications: 5G base station backplanes
  • Medical Equipment: Modular diagnostic systems
  • Data Centers: Server storage tiering solutions

6. Leading Manufacturers & Products

ManufacturerKey Product SeriesTechnical Highlights
Amphenol ICCEdgecard 2.0100Gbps differential signaling
TE ConnectivityALCOSWITCH Gold contact with nickel underplate
MolexImpel SystemSelf-aligning guide features
SamtecEdge Rate 0.8mm contact centerline spacing

7. Selection Recommendations

Key evaluation criteria:

  • Signal integrity requirements (rise time vs. bit rate)
  • Thermal management capabilities (current carrying capacity)
  • Environmental sealing (IP rating requirements)
  • Backward compatibility needs
  • Vibration resistance specifications

Recommended to perform insertion loss testing at operating frequencies above 10Gbps.

8. Market Trends

Current development focuses on:

  • 802.3dj-compliant 56Gbps PAM4 signaling support
  • Hybrid optical-electrical interface integration
  • Miniaturization to 0.4mm contact pitch
  • Halogen-free material adoption (IEC 62573 compliance)
  • Embedded diagnostics capabilities

Market growth projected at 6.2% CAGR through 2028 according to Bishop & Associates research.

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