Card Edge Connectors - Adapters

Image Part Number Description / PDF Quantity Rfq
EAC12FSLN

EAC12FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 24POS

0

EAC50FSLN

EAC50FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 100POS

0

EAC10FSLN

EAC10FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 20POS

0

EAC36FSLN

EAC36FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 72POS

0

EAC43FSLN

EAC43FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 86POS

0

AAC06FSLN

AAC06FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 12POS

0

AAC22FSLN

AAC22FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 44POS

0

AAC50FSLN

AAC50FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 100POS

0

EAC18FSLN

EAC18FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 36POS

0

EAC06FSLN

EAC06FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 12POS

0

AAC10FSLN

AAC10FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 20POS

0

AAC12FSLN

AAC12FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 24POS

0

EAC22FSLN

EAC22FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 44POS

0

EAC15FSLN

EAC15FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 30POS

0

AAC43FSLN

AAC43FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 86POS

0

EAC36FSLD

EAC36FSLD

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 72POS

0

EAC15FSLD

EAC15FSLD

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 30POS

0

AAC36FSLN

AAC36FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 72POS

0

EAC05FSLN

EAC05FSLN

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 10POS

0

AAC35FSLD

AAC35FSLD

Sullins Connector Solutions

CONN EDGE ADAPT CARD-CARD 70POS

0

Card Edge Connectors - Adapters

1. Overview

Card Edge Connectors - Adapters are hybrid solutions combining printed circuit board (PCB) edge connectors with interface conversion capabilities. They enable direct board-to-board connections while facilitating protocol, form factor, or signal standard transitions. These components are critical in modern electronics for expanding functionality, enabling modular designs, and ensuring compatibility across generations of hardware architectures.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
PCIe Expansion AdaptersHigh-speed protocol conversion (e.g., PCIe Gen4 to NVMe)SSD storage expansion cards
Hybrid Memory AdaptersDRAM standard conversion (e.g., SODIMM to microDIMM)Industrial computer upgrades
IO Interface ConvertersPhysical layer translation (e.g., SATA to M.2)Embedded system integration
High-Speed MezzanineParallel bus to serial protocol conversionTelecom backplane systems

3. Structure & Components

Typical construction includes:

  • Stamped contact elements (phosphor bronze with gold plating)
  • High-temperature thermoplastic insulation (LCP or nylon 6T)
  • Anti-vibration polarization keying systems
  • EMI shielding cages (optional)
  • PCB mounting guides with compliance features

Advanced designs integrate signal conditioning ICs for high-speed applications.

4. Key Technical Specifications

ParameterTypical RangeCritical Importance
Insertion Force30-80NDirectly impacts connector longevity
Contact Resistance5-20m Signal integrity maintenance
DWV Rating500VACSafety and reliability assurance
Bit Rate0.5-32GbpsDefines application suitability
Mating Cycles500-10,000Product lifecycle determination

5. Application Fields

Primary use in:

  • Consumer Electronics: Laptop memory expansion
  • Industrial Automation: PLC modular I/O systems
  • Telecommunications: 5G base station backplanes
  • Medical Equipment: Modular diagnostic systems
  • Data Centers: Server storage tiering solutions

6. Leading Manufacturers & Products

ManufacturerKey Product SeriesTechnical Highlights
Amphenol ICCEdgecard 2.0100Gbps differential signaling
TE ConnectivityALCOSWITCH Gold contact with nickel underplate
MolexImpel SystemSelf-aligning guide features
SamtecEdge Rate 0.8mm contact centerline spacing

7. Selection Recommendations

Key evaluation criteria:

  • Signal integrity requirements (rise time vs. bit rate)
  • Thermal management capabilities (current carrying capacity)
  • Environmental sealing (IP rating requirements)
  • Backward compatibility needs
  • Vibration resistance specifications

Recommended to perform insertion loss testing at operating frequencies above 10Gbps.

8. Market Trends

Current development focuses on:

  • 802.3dj-compliant 56Gbps PAM4 signaling support
  • Hybrid optical-electrical interface integration
  • Miniaturization to 0.4mm contact pitch
  • Halogen-free material adoption (IEC 62573 compliance)
  • Embedded diagnostics capabilities

Market growth projected at 6.2% CAGR through 2028 according to Bishop & Associates research.

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