Card Edge Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
MM60-EZH039-B5-R850

MM60-EZH039-B5-R850

JAE Electronics

CONN MINI EXPRESS CARD LATCH SMD

4253

SM3ZS067U310-NUT1-R1800

SM3ZS067U310-NUT1-R1800

JAE Electronics

THREADED STANDOFF FOR SM3ZS067U3

8994

NT1R3000

NT1R3000

JAE Electronics

STANDOFF FOR MM60-52B1-B1 3.9MM

1595

MM60-EZH059-B5-R650

MM60-EZH059-B5-R650

JAE Electronics

CONN MINI EXPRESS CARD LATCH SMD

6169

SM3ZS067U410-NUT1-R1200

SM3ZS067U410-NUT1-R1200

JAE Electronics

THREADED STANDOFF FOR SM3ZS067U4

0

SM3ZS067U215-NUT1-R2500

SM3ZS067U215-NUT1-R2500

JAE Electronics

THREADED STANDOFF FOR SM3ZS067U2

0

NT5P08CC5E2L01E

NT5P08CC5E2L01E

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L20D

NT5P08CC5E2L20D

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L40E

NT5P08CC5E2L40E

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L02E

NT5P08CC5E2L02E

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L07G

NT5P08CC5E2L07G

JAE Electronics

CONNECTOR

0

MM60-EZH039-B5-R600

MM60-EZH039-B5-R600

JAE Electronics

CONN MINI EXPRESS CARD LATCH SMD

0

NT5P08CC5E2L07E

NT5P08CC5E2L07E

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L50H

NT5P08CC5E2L50H

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L40H

NT5P08CC5E2L40H

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L15E

NT5P08CC5E2L15E

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L10E

NT5P08CC5E2L10E

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L10H

NT5P08CC5E2L10H

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L60H

NT5P08CC5E2L60H

JAE Electronics

CONNECTOR

0

NT5P08CC5E2L90H

NT5P08CC5E2L90H

JAE Electronics

CONNECTOR

0

Card Edge Connectors - Accessories

1. Overview

Card Edge Connectors (CECs) are interconnection devices that enable electrical and mechanical connections between printed circuit boards (PCBs) and other electronic systems. Their accessories include supporting components like retention clips, guide pins, and dust covers. These elements ensure stable signal transmission, mechanical stability, and environmental protection. CECs are critical in modular electronics design, enabling compact, scalable, and serviceable systems across industries.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row Edge ConnectorsLow-profile design, 0.1" pitch, gold-plated contactsPeripheral expansion cards in desktop PCs
Dual-Row Edge ConnectorsParallel signal routing, EMI shielding, polarization keysServer memory modules (DIMMs)
High-Density CECsMicro-pin layouts (up to 2.54mm pitch), multi-gigabit capabilityTelecom backplanes
Compliance Edge ConnectorsCompliant pin technology for vibration resistanceIndustrial control systems
AccessoriesRetention clips, anti-dust covers, alignment guidesMedical imaging equipment

3. Structure & Technical Composition

A typical CEC assembly consists of:

  • Contact System: Beryllium copper alloy contacts with 30 " gold plating for low resistance
  • Insulation Housing: LCP (Liquid Crystal Polymer) material with UL94 V-0 flammability rating
  • Mechanical Reinforcement: Zinc alloy structural members for 500+ insertion cycles
  • Accessories: Spring-loaded retention clips with 0.8N holding force

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power delivery capacity
Contact Resistance5-20m Impacts signal integrity
Dielectric Strength500-1500VACSafety insulation compliance
Operating Temp-55 C to +125 CEnvironmental reliability
Mating Cycles500-10,000 cyclesProduct longevity

5. Application Fields

  • Computing: GPU cards, server motherboards
  • Telecommunications: 5G base stations, optical transceivers
  • Industrial: CNC machine controllers
  • Medical: MRI scanner modules
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey Features
Amphenol ICCSmartSpring CECSelf-cleaning contacts, 3.2mm thickness
MolexMX Edge128-position DDR4 memory connector
TE ConnectivityEdgelock Z-PinZero insertion force design
SamtecEdge Rate100Gbps differential pairs
JAE ElectronicsMB01 SeriesAnti-vibration locking mechanism

7. Selection Guidelines

Key considerations:

  • Signal speed requirements (e.g., PCIe 5.0 needs 32Gbps+ capability)
  • Space constraints (mobile devices require 1.5mm profile connectors)
  • Environmental conditions (automotive applications demand AEC-Q200 compliance)
  • Cost-volume tradeoffs (high-density connectors cost 30-50% more than standard types)

Case Study: In industrial IoT gateways, TE Connectivity's Edgelock Z-Pin was selected for its 2,000-cycle durability and 168-hour salt spray resistance, ensuring reliability in harsh environments.

8. Industry Trends

Emerging developments include:

  • High-speed CECs supporting 112Gbps PAM4 signaling
  • Miniaturization to 0.8mm pitch for wearable medical devices
  • Integrated EMI shielding in plastic housings
  • Smart connectors with embedded temperature sensors
  • RoHS-compliant nanocoatings replacing traditional gold plating
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