Card Edge Connectors - Accessories

Part Number	Description / PDF	Quantity
616-220-301 EDAC Inc.	UNI GUIDE	251
423-035-520-102 EDAC Inc.	CONN PLUG 35POS .200X.300 GOLD	50
307-220-078 EDAC Inc.	CARD GUIDE	212
341-240-318 EDAC Inc.	POLARIZING KEY BETWEEN CONTACT	0
345-220-058 EDAC Inc.	CARD GUIDE OFFSET	0
307-220-058 EDAC Inc.	CARD GUIDE	375
345-240-328 EDAC Inc.	POLARIZING KEY IN-CONTACT	187
423-023-520-102 EDAC Inc.	CONN PLUG 23POS .200X.300 GOLD	16
616-220-305 EDAC Inc.	UNI GUIDE	0
616-220-313 EDAC Inc.	UNIGUIDE 11" X .205" GRAY	0
307-240-328 EDAC Inc.	POLARIZING KEY IN-CONTACT DL ROW	712
616-220-304 EDAC Inc.	UNI GUIDE	75
345-240-318 EDAC Inc.	POLARIZING KEY BETWEEN CONTACT	1609
306-240-318 EDAC Inc.	POLARIZING KEY BETWEEN CONTACT	2611
616-220-303 EDAC Inc.	UNI GUIDE	650
338-240-328 EDAC Inc.	CONN POLORIZING KEY	0
616-220-307 EDAC Inc.	UNI GUIDE	0
616-220-310 EDAC Inc.	UNIGUIDE 9" X .141" GRAY	0
616-220-306 EDAC Inc.	UNI GUIDE	0
616-220-311 EDAC Inc.	UNIGUIDE 9" X .205" GRAY	0

Card Edge Connectors - Accessories

1. Overview

Card Edge Connectors (CECs) are interconnection devices that enable electrical and mechanical connections between printed circuit boards (PCBs) and other electronic systems. Their accessories include supporting components like retention clips, guide pins, and dust covers. These elements ensure stable signal transmission, mechanical stability, and environmental protection. CECs are critical in modular electronics design, enabling compact, scalable, and serviceable systems across industries.

2. Main Types & Functional Classification

Type	Functional Features	Application Examples
Single-Row Edge Connectors	Low-profile design, 0.1" pitch, gold-plated contacts	Peripheral expansion cards in desktop PCs
Dual-Row Edge Connectors	Parallel signal routing, EMI shielding, polarization keys	Server memory modules (DIMMs)
High-Density CECs	Micro-pin layouts (up to 2.54mm pitch), multi-gigabit capability	Telecom backplanes
Compliance Edge Connectors	Compliant pin technology for vibration resistance	Industrial control systems
Accessories	Retention clips, anti-dust covers, alignment guides	Medical imaging equipment

3. Structure & Technical Composition

A typical CEC assembly consists of:

Contact System: Beryllium copper alloy contacts with 30 " gold plating for low resistance
Insulation Housing: LCP (Liquid Crystal Polymer) material with UL94 V-0 flammability rating
Mechanical Reinforcement: Zinc alloy structural members for 500+ insertion cycles
Accessories: Spring-loaded retention clips with 0.8N holding force

4. Key Technical Specifications

Parameter	Value Range	Importance
Current Rating	1-5A per contact	Determines power delivery capacity
Contact Resistance	5-20m	Impacts signal integrity
Dielectric Strength	500-1500VAC	Safety insulation compliance
Operating Temp	-55 C to +125 C	Environmental reliability
Mating Cycles	500-10,000 cycles	Product longevity

5. Application Fields

Computing: GPU cards, server motherboards
Telecommunications: 5G base stations, optical transceivers
Industrial: CNC machine controllers
Medical: MRI scanner modules
Transportation: Railway signaling systems

6. Leading Manufacturers & Products

Manufacturer	Product Series	Key Features
Amphenol ICC	SmartSpring CEC	Self-cleaning contacts, 3.2mm thickness
Molex	MX Edge	128-position DDR4 memory connector
TE Connectivity	Edgelock Z-Pin	Zero insertion force design
Samtec	Edge Rate	100Gbps differential pairs
JAE Electronics	MB01 Series	Anti-vibration locking mechanism

7. Selection Guidelines

Key considerations:

Signal speed requirements (e.g., PCIe 5.0 needs 32Gbps+ capability)
Space constraints (mobile devices require 1.5mm profile connectors)
Environmental conditions (automotive applications demand AEC-Q200 compliance)
Cost-volume tradeoffs (high-density connectors cost 30-50% more than standard types)

Case Study: In industrial IoT gateways, TE Connectivity's Edgelock Z-Pin was selected for its 2,000-cycle durability and 168-hour salt spray resistance, ensuring reliability in harsh environments.

8. Industry Trends

Emerging developments include:

High-speed CECs supporting 112Gbps PAM4 signaling
Miniaturization to 0.8mm pitch for wearable medical devices
Integrated EMI shielding in plastic housings
Smart connectors with embedded temperature sensors
RoHS-compliant nanocoatings replacing traditional gold plating