Card Edge Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
3448-58

3448-58

3M

STRAIN RELIEF 50 POS

564

3448-56

3448-56

3M

STRAIN RELIEF 34 POS

57

3439-2

3439-2

3M

CONN KEYING PLUG OR POLARIZAT

128

3448-59

3448-59

3M

STRAIN RELIEF 64 POS

74

3448-31

3448-31

3M

STRAIN RELIEF 60 POS

0

3448-52

3448-52

3M

STRAIN RELIEF 10 POS

0

3448-55

3448-55

3M

STRAIN RELIEF 26 POS

0

3448-57

3448-57

3M

STRAIN RELIEF 40 POS

0

3448-54

3448-54

3M

STRAIN RELIEF 20 POS

0

3448-53

3448-53

3M

STRAIN RELIEF 16 POS

0

Card Edge Connectors - Accessories

1. Overview

Card Edge Connectors (CECs) are interconnection devices that enable electrical and mechanical connections between printed circuit boards (PCBs) and other electronic systems. Their accessories include supporting components like retention clips, guide pins, and dust covers. These elements ensure stable signal transmission, mechanical stability, and environmental protection. CECs are critical in modular electronics design, enabling compact, scalable, and serviceable systems across industries.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row Edge ConnectorsLow-profile design, 0.1" pitch, gold-plated contactsPeripheral expansion cards in desktop PCs
Dual-Row Edge ConnectorsParallel signal routing, EMI shielding, polarization keysServer memory modules (DIMMs)
High-Density CECsMicro-pin layouts (up to 2.54mm pitch), multi-gigabit capabilityTelecom backplanes
Compliance Edge ConnectorsCompliant pin technology for vibration resistanceIndustrial control systems
AccessoriesRetention clips, anti-dust covers, alignment guidesMedical imaging equipment

3. Structure & Technical Composition

A typical CEC assembly consists of:

  • Contact System: Beryllium copper alloy contacts with 30 " gold plating for low resistance
  • Insulation Housing: LCP (Liquid Crystal Polymer) material with UL94 V-0 flammability rating
  • Mechanical Reinforcement: Zinc alloy structural members for 500+ insertion cycles
  • Accessories: Spring-loaded retention clips with 0.8N holding force

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power delivery capacity
Contact Resistance5-20m Impacts signal integrity
Dielectric Strength500-1500VACSafety insulation compliance
Operating Temp-55 C to +125 CEnvironmental reliability
Mating Cycles500-10,000 cyclesProduct longevity

5. Application Fields

  • Computing: GPU cards, server motherboards
  • Telecommunications: 5G base stations, optical transceivers
  • Industrial: CNC machine controllers
  • Medical: MRI scanner modules
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey Features
Amphenol ICCSmartSpring CECSelf-cleaning contacts, 3.2mm thickness
MolexMX Edge128-position DDR4 memory connector
TE ConnectivityEdgelock Z-PinZero insertion force design
SamtecEdge Rate100Gbps differential pairs
JAE ElectronicsMB01 SeriesAnti-vibration locking mechanism

7. Selection Guidelines

Key considerations:

  • Signal speed requirements (e.g., PCIe 5.0 needs 32Gbps+ capability)
  • Space constraints (mobile devices require 1.5mm profile connectors)
  • Environmental conditions (automotive applications demand AEC-Q200 compliance)
  • Cost-volume tradeoffs (high-density connectors cost 30-50% more than standard types)

Case Study: In industrial IoT gateways, TE Connectivity's Edgelock Z-Pin was selected for its 2,000-cycle durability and 168-hour salt spray resistance, ensuring reliability in harsh environments.

8. Industry Trends

Emerging developments include:

  • High-speed CECs supporting 112Gbps PAM4 signaling
  • Miniaturization to 0.8mm pitch for wearable medical devices
  • Integrated EMI shielding in plastic housings
  • Smart connectors with embedded temperature sensors
  • RoHS-compliant nanocoatings replacing traditional gold plating
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