Card Edge Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
616-220-313

616-220-313

EDAC Inc.

UNIGUIDE 11" X .205" GRAY

0

583462-1

583462-1

TE Connectivity AMP Connectors

CONN CARDEDGE KEYING PLUG

0

530030-1

530030-1

TE Connectivity AMP Connectors

TWIN LF KEYING PLUG

0

307-240-328

307-240-328

EDAC Inc.

POLARIZING KEY IN-CONTACT DL ROW

712

NT1R3000

NT1R3000

JAE Electronics

STANDOFF FOR MM60-52B1-B1 3.9MM

1595

616-220-304

616-220-304

EDAC Inc.

UNI GUIDE

75

345-240-318

345-240-318

EDAC Inc.

POLARIZING KEY BETWEEN CONTACT

1609

3448-56

3448-56

3M

STRAIN RELIEF 34 POS

57

306-240-318

306-240-318

EDAC Inc.

POLARIZING KEY BETWEEN CONTACT

2611

MM60-EZH059-B5-R650

MM60-EZH059-B5-R650

JAE Electronics

CONN MINI EXPRESS CARD LATCH SMD

6169

650025-2

650025-2

TE Connectivity AMP Connectors

KEY PLUG-SHORT

9568

3439-2

3439-2

3M

CONN KEYING PLUG OR POLARIZAT

128

583760-1

583760-1

TE Connectivity AMP Connectors

CONN CARDEDGE CARD GUIDE BLACK

0

616-220-303

616-220-303

EDAC Inc.

UNI GUIDE

650

SM3ZS067U410-NUT1-R1200

SM3ZS067U410-NUT1-R1200

JAE Electronics

THREADED STANDOFF FOR SM3ZS067U4

0

338-240-328

338-240-328

EDAC Inc.

CONN POLORIZING KEY

0

3448-59

3448-59

3M

STRAIN RELIEF 64 POS

74

616-220-307

616-220-307

EDAC Inc.

UNI GUIDE

0

583671-1

583671-1

TE Connectivity AMP Connectors

CONN CARD GUIDE SINGLE SLOT BLK

1464

616-220-310

616-220-310

EDAC Inc.

UNIGUIDE 9" X .141" GRAY

0

Card Edge Connectors - Accessories

1. Overview

Card Edge Connectors (CECs) are interconnection devices that enable electrical and mechanical connections between printed circuit boards (PCBs) and other electronic systems. Their accessories include supporting components like retention clips, guide pins, and dust covers. These elements ensure stable signal transmission, mechanical stability, and environmental protection. CECs are critical in modular electronics design, enabling compact, scalable, and serviceable systems across industries.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row Edge ConnectorsLow-profile design, 0.1" pitch, gold-plated contactsPeripheral expansion cards in desktop PCs
Dual-Row Edge ConnectorsParallel signal routing, EMI shielding, polarization keysServer memory modules (DIMMs)
High-Density CECsMicro-pin layouts (up to 2.54mm pitch), multi-gigabit capabilityTelecom backplanes
Compliance Edge ConnectorsCompliant pin technology for vibration resistanceIndustrial control systems
AccessoriesRetention clips, anti-dust covers, alignment guidesMedical imaging equipment

3. Structure & Technical Composition

A typical CEC assembly consists of:

  • Contact System: Beryllium copper alloy contacts with 30 " gold plating for low resistance
  • Insulation Housing: LCP (Liquid Crystal Polymer) material with UL94 V-0 flammability rating
  • Mechanical Reinforcement: Zinc alloy structural members for 500+ insertion cycles
  • Accessories: Spring-loaded retention clips with 0.8N holding force

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power delivery capacity
Contact Resistance5-20m Impacts signal integrity
Dielectric Strength500-1500VACSafety insulation compliance
Operating Temp-55 C to +125 CEnvironmental reliability
Mating Cycles500-10,000 cyclesProduct longevity

5. Application Fields

  • Computing: GPU cards, server motherboards
  • Telecommunications: 5G base stations, optical transceivers
  • Industrial: CNC machine controllers
  • Medical: MRI scanner modules
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey Features
Amphenol ICCSmartSpring CECSelf-cleaning contacts, 3.2mm thickness
MolexMX Edge128-position DDR4 memory connector
TE ConnectivityEdgelock Z-PinZero insertion force design
SamtecEdge Rate100Gbps differential pairs
JAE ElectronicsMB01 SeriesAnti-vibration locking mechanism

7. Selection Guidelines

Key considerations:

  • Signal speed requirements (e.g., PCIe 5.0 needs 32Gbps+ capability)
  • Space constraints (mobile devices require 1.5mm profile connectors)
  • Environmental conditions (automotive applications demand AEC-Q200 compliance)
  • Cost-volume tradeoffs (high-density connectors cost 30-50% more than standard types)

Case Study: In industrial IoT gateways, TE Connectivity's Edgelock Z-Pin was selected for its 2,000-cycle durability and 168-hour salt spray resistance, ensuring reliability in harsh environments.

8. Industry Trends

Emerging developments include:

  • High-speed CECs supporting 112Gbps PAM4 signaling
  • Miniaturization to 0.8mm pitch for wearable medical devices
  • Integrated EMI shielding in plastic housings
  • Smart connectors with embedded temperature sensors
  • RoHS-compliant nanocoatings replacing traditional gold plating
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