| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
CUI Devices |
ADAPT DB15F TO 6P6C JACK BLACK |
0 |
|
 |
CUI Devices |
ADAPT DB9M TO RJ45 JACK BLACK |
0 |
|
 |
CUI Devices |
ADAPT DB15F TO RJ45 JACK BLACK |
0 |
|
 |
CUI Devices |
ADAPT DB9M TO 6P6C JACK BLACK |
0 |
|
 |
CUI Devices |
ADAPT DB25F TO RJ45 JACK BLACK |
0 |
|
 |
CUI Devices |
ADAPT DB25M TO 6P6C JACK BLACK |
0 |
|
 |
CUI Devices |
ADAPT DB9F TO 6P6C JACK BLACK |
0 |
|
 |
CUI Devices |
ADAPT DB9F TO RJ45 JACK BLACK |
0 |
|
 |
CUI Devices |
ADAPT BNC PLUG TO RJ11 JACK BLK |
0 |
|
 |
CUI Devices |
ADAPT DB25F TO 6P6C JACK BLACK |
0 |
|
 |
CUI Devices |
ADAPT DB15M TO RJ45 JACK GRAY |
0 |
|
 |
CUI Devices |
ADAPT DB25M TO RJ45 JACK BLACK |
0 |
|
 |
CUI Devices |
ADAPT DB15M TO 6P6C JACK BLACK |
0 |
|
Between Series Adapters (BSA) are interconnect solutions that bridge incompatible electrical or data interfaces across different device series or standards. These adapters enable seamless signal/power transmission while maintaining performance integrity. In modern electronics, BSAs are critical for system integration in industrial automation, telecommunications, and consumer electronics, where heterogeneous hardware ecosystems demand interoperability.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Protocol Conversion Adapters | Translates signaling protocols (e.g., RS-232 to USB) | Industrial PLC programming interfaces |
| Physical Interface Adapters | Mechanical/electrical conversion between connector styles | DB9 to RJ45 Ethernet converters |
| Signal Conditioning Adapters | Modifies signal voltage levels or impedance matching | RF coaxial to waveguide transitions |
| Hybrid Power/Data Adapters | Simultaneous power and high-speed data transmission | PoE++ to USB4 combination adapters |
Typical BSAs consist of: - Termination Substrate: Gold-plated phosphor bronze contacts (0.1-0.8mm thickness) - Insulation Body: LCP/LPA engineering plastic (UL94 V-0 rating) - Shielding Layer: 0.1mm thick aluminum-mylar composite - Retention Mechanism: Threaded coupling or push-pull latching - Signal Path: Precision-machined PCB traces (impedance controlled to 5%)
| Parameter | Typical Range | Importance |
|---|---|---|
| Contact Resistance | 5-20m | Affects signal integrity and power efficiency |
| Insulation Resistance | >1G | Determines leakage current safety |
| Current Rating | 1-15A | Dictates power handling capability |
| VSWR (RF Adapters) | 1.2:1-1.8:1 | Measures signal reflection performance |
| Operating Temperature | -55 C to +125 C | Ensures environmental reliability |
| Manufacturer | Key Product Series | Technical Highlights |
|---|---|---|
| TE Connectivity | CONSENT Hybrid Adapters | 20Gbps data rate + 12A power capacity |
| Amphenol | MIL-DTL-38999 Series III | Hermetically sealed aerospace connectors |
| Molex | SL Series Adapters | 0.5mm pitch for compact medical devices |
| Samtec | USB4 Protocol Converters | Backward compatible with USB3.2/Thunderbolt |
Key considerations include: - Interface compatibility (pin count, pitch spacing) - Environmental requirements (IP rating, temperature range) - Signal bandwidth requirements (rise time <1ns requires <3GHz bandwidth) - Mechanical durability (>5000 mating cycles for industrial) - Compliance with standards (IEC 61076, MIL-STD-810)
Case Study: In automotive test systems, selecting a CAN-FD to Ethernet BSA with IP67 rating and EMI shielding reduced field failure rates by 72%.
Future developments include: - Integration of active signal conditioning ICs in adapters - Nano-coating technologies for corrosion resistance - Software-defined pin assignment for reconfigurable interfaces - Adoption of AI-driven contact wear prediction algorithms - Growth in optical/electrical hybrid adapters for 800Gbps+ systems