Backplane Connectors - Specialized

Image Part Number Description / PDF Quantity Rfq
RVPX-J16MM2

RVPX-J16MM2

Amphenol Aerospace Operations

BACKPLANE, 16 POSITION, MIDDLE,

0

RVPX-PE216DM2

RVPX-PE216DM2

Amphenol Aerospace Operations

DAUGHTERCARD, EVO 2, RIGHT ANGLE

45

RVPX-P16DM1

RVPX-P16DM1

Amphenol Aerospace Operations

DAUGHTERCARD, 16 POSITION DIFFER

45

RVPX-P16DM2

RVPX-P16DM2

Amphenol Aerospace Operations

DAUGHTERCARD, 16 POSITION DIFFER

2

RVPX-JE216EM1

RVPX-JE216EM1

Amphenol Aerospace Operations

BACKPLANE, EVO 2, RIGHT END, 16

0

10-504637-004

10-504637-004

Amphenol Aerospace Operations

VITA 66.1 FIBER MODULE 2MT- SPEC

0

RVPX-JE216MM2

RVPX-JE216MM2

Amphenol Aerospace Operations

BACKPLANE, EVO 2, MIDDLE, 16 POS

0

RVPX-P16SM1

RVPX-P16SM1

Amphenol Aerospace Operations

DAUGHTERCARD, 16 POSITION SINGLE

38

RVPX-P08VM2

RVPX-P08VM2

Amphenol Aerospace Operations

DAUGHTERCARD, 8 POSITION DIFFERE

0

RVPX-J08EM2

RVPX-J08EM2

Amphenol Aerospace Operations

BACKPLANE, 8 POSITION, LEFT END,

45

RVPX-JE216MM1

RVPX-JE216MM1

Amphenol Aerospace Operations

BACKPLANE, EVO 2, MIDDLE, 16 POS

45

RVPX-PE16DM2

RVPX-PE16DM2

Amphenol Aerospace Operations

DAUGHTERCARD, EVO 1, 16 POSITION

22

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
High-Speed Backplane ConnectorsSupport data rates >25 Gbps with controlled impedanceData center switches, 5G base stations
High-Power Backplane ConnectorsRated for >50A per contact with thermal managementIndustrial motor drives, EV charging systems
High-Density Backplane ConnectorsMiniaturized contacts with pitch <1.0mmMedical imaging equipment, test instrumentation
Hermetic Backplane ConnectorsIP68-rated sealing for extreme environmentsSubsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating1-100APower transmission capability
Contact Resistance0.5-5m Signal integrity maintenance
Dielectric Withstanding Voltage500V-5kVElectrical safety assurance
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500-20,000Long-term durability

5. Application Fields

  • Telecommunications: 5G NR base stations, optical transport networks
  • Industrial: Programmable logic controllers (PLCs), robotics
  • Medical: MRI scanners, digital radiography systems
  • Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Feature
TE ConnectivityHypertac Backplane100Gbps data rate with floating contact design
AmphenolRosenberger 400GbpsModular architecture for scalable networks
MolexImpel High-SpeedDifferential pair shielding for signal integrity

7. Selection Guidelines

  1. Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
  2. Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
  3. Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
  4. Confirm RoHS/REACH compliance for regulatory requirements
  5. Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors

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