Backplane Connectors - Specialized

Part Number	Description / PDF	Quantity
17610042101 HARTING	CONN PLUG BLADE PWR 4POS EDGE MT	76
16340961101000 HARTING	CONN PWR MOD MTCA 96POS PCB	15
16320341101000 HARTING	CONN PLUG POWER 34POS PCB	64
16111705205000 HARTING	CONN HEADER AMC 170POS PCB	60
07119000024 HARTING	CONN RCPT COAX 4POS PCB	100
16041705106000 HARTING	CONN HEADER AMC 170POS PCB	8
16041705104000 HARTING	CONN HEADER AMC 170POS PCB	39
07111000024 HARTING	CONN RCPT COAX 8POS PCB	0
16111705207000 HARTING	CONN HEADER AMC 170POS PCB	4
16330961201000 HARTING	CONN PWR MOD MTCA 96POS PCB	16
16320301101000 HARTING	CONN PLUG POWER 34POS PCB	7
16111705202000 HARTING	CONN HEADER AMC 170POS PCB	21
17610042802 HARTING	CONN PLUG BLADE PWR 4POS EDGE MT	18
07311000020 HARTING	CONN PLUG COAX 8POS EDGE MNT	0
17610042102 HARTING	CONN HEADER BLADE PWR 4POS PCB	26
07311000021 HARTING	CONN PLUG COAX 10POS EDGE MNT	5
16310341201000 HARTING	CONN RCPT POWER 34POS PCB	86
16111705206000 HARTING	CONN HEADER AMC 170POS PCB	584
07311000027 HARTING	CONN PLUG COAX 6POS PCB	0
17660042201 HARTING	CONN RCPT BLADE PWR 4POS PCB	16

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Speed Backplane Connectors	Support data rates >25 Gbps with controlled impedance	Data center switches, 5G base stations
High-Power Backplane Connectors	Rated for >50A per contact with thermal management	Industrial motor drives, EV charging systems
High-Density Backplane Connectors	Miniaturized contacts with pitch <1.0mm	Medical imaging equipment, test instrumentation
Hermetic Backplane Connectors	IP68-rated sealing for extreme environments	Subsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-100A	Power transmission capability
Contact Resistance	0.5-5m	Signal integrity maintenance
Dielectric Withstanding Voltage	500V-5kV	Electrical safety assurance
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500-20,000	Long-term durability

5. Application Fields

Telecommunications: 5G NR base stations, optical transport networks
Industrial: Programmable logic controllers (PLCs), robotics
Medical: MRI scanners, digital radiography systems
Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
TE Connectivity	Hypertac Backplane	100Gbps data rate with floating contact design
Amphenol	Rosenberger 400Gbps	Modular architecture for scalable networks
Molex	Impel High-Speed	Differential pair shielding for signal integrity

7. Selection Guidelines

Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
Confirm RoHS/REACH compliance for regulatory requirements
Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors