| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Woodhead - Molex |
CONN RCPT LPHPOWER 34POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER IMPACT 54POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER IMPACT 144POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER GBX 200POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER IMPACT 216POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER HDM 72POS PCB |
0 |
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Woodhead - Molex |
CONN PLUG LPHPOWER 30POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER GBX 80POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER GBX 200POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER IMPACT 72POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER HDM 144POS PCB |
0 |
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Woodhead - Molex |
CONN HDR IMPACT 96POS EDGE MNT |
0 |
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Woodhead - Molex |
CONN HEADER GBX 200POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER VHDM 80POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER POWER 8POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER GBX 100POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER IMPACT 288POS PCB |
0 |
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Woodhead - Molex |
CONN PLUG LPHPOWER 30POS PCB |
0 |
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Woodhead - Molex |
CONN PLUG LPHPOWER 46POS PCB |
0 |
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Woodhead - Molex |
CONN HEADER IMPACT 120POS PCB |
0 |
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Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| High-Speed Backplane Connectors | Support data rates >25 Gbps with controlled impedance | Data center switches, 5G base stations |
| High-Power Backplane Connectors | Rated for >50A per contact with thermal management | Industrial motor drives, EV charging systems |
| High-Density Backplane Connectors | Miniaturized contacts with pitch <1.0mm | Medical imaging equipment, test instrumentation |
| Hermetic Backplane Connectors | IP68-rated sealing for extreme environments | Subsea sensors, military avionics |
Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins
| Parameter | Typical Range | Importance |
|---|---|---|
| Current Rating | 1-100A | Power transmission capability |
| Contact Resistance | 0.5-5m | Signal integrity maintenance |
| Dielectric Withstanding Voltage | 500V-5kV | Electrical safety assurance |
| Operating Temperature | -55 C to +125 C | Environmental reliability |
| Mating Cycles | 500-20,000 | Long-term durability |
| Manufacturer | Representative Product | Key Feature |
|---|---|---|
| TE Connectivity | Hypertac Backplane | 100Gbps data rate with floating contact design |
| Amphenol | Rosenberger 400Gbps | Modular architecture for scalable networks |
| Molex | Impel High-Speed | Differential pair shielding for signal integrity |
Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors