Backplane Connectors - Specialized

Image Part Number Description / PDF Quantity Rfq
DLM2-96PW6A

DLM2-96PW6A

VEAM

CONN PLUG 96POS PNL MNT

46

DL3-60RW4B

DL3-60RW4B

VEAM

CONN RCPT 60POS PNL MNT

0

DL3-60PW4A

DL3-60PW4A

VEAM

CONN PLUG 60POS PNL MNT

0

DLM1-156RW6B

DLM1-156RW6B

VEAM

CONN RCPT 156POS PNL MNT

245

DLM5-260RW6B

DLM5-260RW6B

VEAM

CONN RCPT 260POS PNL MNT

40

DL1-156PW4A

DL1-156PW4A

VEAM

CONN PLUG 156POS PNL MNT

38

DL1-156RW-6B

DL1-156RW-6B

VEAM

CONN RCPT 156POS PNL MNT

178

QLC260P

QLC260P

VEAM

CONN PLUG 260POS

314

DL2-96RW-4B

DL2-96RW-4B

VEAM

CONN RCPT 96POS PNL MNT

166

QLC260R

QLC260R

VEAM

CONN RCPT 260POS PCB

49

DL5-260RW4B

DL5-260RW4B

VEAM

CONN RCPT 260POS PNL MNT

57

DLM5-260PW6A

DLM5-260PW6A

VEAM

CONN PLUG 260POS PNL MNT

189

DLM3-60RW6B

DLM3-60RW6B

VEAM

CONN RCPT 60POS PNL MNT

8

DL5-260PW-6A

DL5-260PW-6A

VEAM

CONN PLUG 260POS PNL MNT

105

DL5-260RW6B

DL5-260RW6B

VEAM

CONN RCPT 260POS PNL MNT

111

DL2-96PW6A

DL2-96PW6A

VEAM

CONN PLUG 96POS PNL MNT

123

DL1-156RW-4B

DL1-156RW-4B

VEAM

CONN RCPT 156POS PNL MNT

424

DL3-60RW6B

DL3-60RW6B

VEAM

CONN RCPT 60POS PNL MNT

88

QLC260P2

QLC260P2

VEAM

CONN PLUG 260POS

25

DLM1-156PW6A

DLM1-156PW6A

VEAM

CONN PLUG 156POS PNL MNT

78

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
High-Speed Backplane ConnectorsSupport data rates >25 Gbps with controlled impedanceData center switches, 5G base stations
High-Power Backplane ConnectorsRated for >50A per contact with thermal managementIndustrial motor drives, EV charging systems
High-Density Backplane ConnectorsMiniaturized contacts with pitch <1.0mmMedical imaging equipment, test instrumentation
Hermetic Backplane ConnectorsIP68-rated sealing for extreme environmentsSubsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating1-100APower transmission capability
Contact Resistance0.5-5m Signal integrity maintenance
Dielectric Withstanding Voltage500V-5kVElectrical safety assurance
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500-20,000Long-term durability

5. Application Fields

  • Telecommunications: 5G NR base stations, optical transport networks
  • Industrial: Programmable logic controllers (PLCs), robotics
  • Medical: MRI scanners, digital radiography systems
  • Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Feature
TE ConnectivityHypertac Backplane100Gbps data rate with floating contact design
AmphenolRosenberger 400GbpsModular architecture for scalable networks
MolexImpel High-SpeedDifferential pair shielding for signal integrity

7. Selection Guidelines

  1. Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
  2. Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
  3. Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
  4. Confirm RoHS/REACH compliance for regulatory requirements
  5. Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors

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