Backplane Connectors - Specialized

Part Number	Description / PDF	Quantity
HDTM-3-06-1-S-VT-0-1 Samtec, Inc.	CONN HEADER XCEDE 36POS PCB	28
EBTM-6-12-2.0-S-VT-1 Samtec, Inc.	CONN HEADER EXAMAX 144POS PCB	61
LPHS-04-24-L-VP1-GP Samtec, Inc.	CONN SCKT LPHPOWER 28POS PCB	54
HDTM-4-06-1-S-VT-0-1 Samtec, Inc.	CONN HEADER XCEDE 48POS PCB	28
HDTF-4-06-S-RA-LC-100 Samtec, Inc.	CONN RCPT XCEDE 48POS EDGE MNT	11
ET60S-D04-3-08-D04-L-V1-S Samtec, Inc.	CONN SKT PWR SIGNAL COMBO	49
EBTM-4-10-2.0-S-VT-1 Samtec, Inc.	CONN HEADER EXAMAX 80POS PCB	74
HDTF-3-06-S-RA-LC-100 Samtec, Inc.	CONN RCPT XCEDE 36POS EDGE MNT	18
ET60T-D06-3-08-D06-L-R1-S Samtec, Inc.	CONN SIGNAL/PWR COMBO 60A	30
EBTF-4-10-2.0-S-RA-1 Samtec, Inc.	CONN RCPT EXAMAX 80POS PCB	150
ET60S-D02-0-00-D02-L-R1-S Samtec, Inc.	.100" EXTREME TEN60POWER 60 AMP	115
ET60S-D03-0-00-D03-L-R1-S Samtec, Inc.	CONN SIGNAL/PWR COMBO 60A	82
ET60T-D06-0-00-D06-L-R1-S Samtec, Inc.	CONN SIGNAL/PWR COMBO 60A	123
EBTF-6-12-2.0-S-RA-1 Samtec, Inc.	CONN RCPT EXAMAX 144POS PCB	124
LPHT-04-24-L-RT1-GP Samtec, Inc.	CONN PLUG LPHPOWER 28POS PCB	38
ET60T-D03-0-00-D02-L-R1-S-H Samtec, Inc.	CONN HEADER 5POS PCB	0
ET60S-D04-3-08-000-L-V1-S Samtec, Inc.	CONN RCPT 28POS PCB	0
ET60S-D02-3-08-D02-S-VP-S Samtec, Inc.	CONN RCPT 28POS PCB	0
ET60S-D04-0-00-D04-S-V1-S Samtec, Inc.	CONN RCPT 8POS PCB	0
ET60T-D06-3-08-000-L-R1-S-H Samtec, Inc.	CONN HEADER 30POS PCB	0

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Speed Backplane Connectors	Support data rates >25 Gbps with controlled impedance	Data center switches, 5G base stations
High-Power Backplane Connectors	Rated for >50A per contact with thermal management	Industrial motor drives, EV charging systems
High-Density Backplane Connectors	Miniaturized contacts with pitch <1.0mm	Medical imaging equipment, test instrumentation
Hermetic Backplane Connectors	IP68-rated sealing for extreme environments	Subsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-100A	Power transmission capability
Contact Resistance	0.5-5m	Signal integrity maintenance
Dielectric Withstanding Voltage	500V-5kV	Electrical safety assurance
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500-20,000	Long-term durability

5. Application Fields

Telecommunications: 5G NR base stations, optical transport networks
Industrial: Programmable logic controllers (PLCs), robotics
Medical: MRI scanners, digital radiography systems
Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
TE Connectivity	Hypertac Backplane	100Gbps data rate with floating contact design
Amphenol	Rosenberger 400Gbps	Modular architecture for scalable networks
Molex	Impel High-Speed	Differential pair shielding for signal integrity

7. Selection Guidelines

Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
Confirm RoHS/REACH compliance for regulatory requirements
Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors