Backplane Connectors

Backplane Connectors - Housings

Part Number	Description / PDF	Quantity
88911-101LF Storage & Server IO (Amphenol ICC)	CONN RCPT HSG 1POS NATURAL PCB	2462
2212282-1 TE Connectivity AMP Connectors	FORGE, ASSY PIN, 5/0-0/4-0/8-0/1	288
516-056-000-101 EDAC Inc.	CONN HSG RACK & PANEL 56POS GRN	491
201692-9 TE Connectivity AMP Connectors	CONN 104POS BLUE PNL MNT	0
223041-3 TE Connectivity AMP Connectors	CONN SHROUD HARD METRIC 90P NAT	0
1725103412 Woodhead - Molex	CONN RCPT HSG EXTREME 16POS BLK	598
516-020-000-302 EDAC Inc.	CONN HSG RACK & PANEL 20POS GRY	47
1648212-1 TE Connectivity AMP Connectors	CONN RCPT HSG DRAWER 32POS BLK	39
1648117-1 TE Connectivity AMP Connectors	CONN RCPT HSG MIN-DRAWER 22P BLK	0
QR/P-12S-C(21) Hirose	CONN RCPT HSG RACK & PNL 12P BLU	59
516-038-000-601 EDAC Inc.	CONN HSG RACK & PANEL 38POS GRN	0
09020643214 HARTING	CONN RCPT HSG DIN 41612 64P GRY	312
QR/P-12S-C(51) Hirose	CONN RCPT HSG RACK & PNL 12P BLU	0
QR/P-24P-C(01) Hirose	CONN PLUG HSG RACK & PNL 24P BLU	0
1650679-1 TE Connectivity AMP Connectors	750-22-0320J=SA HOUSING SKT J	0
02050000005 HARTING	CONN RCPT HSG HAR-BUS 160POS	0
516-090-000-302 EDAC Inc.	CONN HSG RACK & PANEL 90POS GRY	23
1650667-1 TE Connectivity AMP Connectors	HOUSING	4
212608-1 TE Connectivity AMP Connectors	CONN RCPT HSG DRAWER 4POS BLK	749
QR/P1-32P-C(51) Hirose	CONN PLUG HSG RACK & PNL 32P BLK	150

Backplane Connectors - Housings

1. Overview

Backplane connectors housings are critical electromechanical components that enable high-density interconnections between printed circuit boards (PCBs) in complex electronic systems. These housings serve as structural supports and alignment guides for mating contacts while providing environmental protection and mechanical stability. Their importance in modern technology lies in enabling scalable, high-speed data transmission architectures for telecommunications, computing, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Density Housings	Miniaturized contact spacing ( 2.54mm), supports >1000 contacts	Data center switches, blade servers
High-Speed Housings	Controlled impedance (100 10 ), supports >25Gbps differential pairs	5G base stations, optical transport systems
Modular Housings	Field-replaceable contact inserts, tool-less assembly	Industrial control cabinets, test equipment
Power-Optimized Housings	High-current contacts (up to 30A), thermal management features	Power distribution units, energy storage systems

3. Structure and Composition

Typical backplane housing assemblies consist of:

Dielectric Frame: LCP or PBT thermoplastic with UL94 V-0 flammability rating
Contact Cavities: Precision-machined compartments with polarizing keys
Shielding Elements: Integrated EMI gaskets and conductive plating (often tin-over-nickel)
Mounting Features: Through-hole or surface-mount retention pegs with anti-rotation tabs
Thermal Management: Ventilation channels and heat-dissipating fins (for power variants)

4. Key Technical Specifications

Parameter	Typical Range	Importance
Contact Resistance	5-20m	Impacts signal integrity and power efficiency
Insulation Resistance	>1000M	Ensures electrical safety and crosstalk prevention
Current Rating	1-30A per contact	Determines power delivery capacity
Voltage Withstand	500-1500VAC	Crucial for high-voltage isolation
Operating Temperature	-55 C to +125 C	Affects reliability in harsh environments
Insertion Force	20-80N	Influences mating durability and tooling requirements

5. Application Fields

Primary industries utilizing backplane connector housings include:

Telecommunications (5G NR base stations, core routers)
Data centers (U.2 SSD backplanes, AI accelerator racks)
Industrial automation (PLC backplanes, CNC controller arrays)
Medical imaging (MRI scanner detector interconnects)
Military/aerospace (avionics databus backplanes)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	MegArray 2.0	25Gbps capability, 2000+ contact density
Amphenol ICC	CB1-AU Series	Modular architecture with hot-swap capability
Molex	Impel System	Scalable from 1U to 10U rack configurations
Samtec	Arrowstone	0.8mm contact pitch with self-aligning guides

7. Selection Recommendations

Key considerations during component selection:

Signal integrity requirements (rise time vs. bandwidth)
Mechanical mating cycles (500+ for test equipment applications)
Thermal derating curves for high-current scenarios
Compliance with industry standards (IPC-6012, MIL-STD-810)
Field serviceability requirements (modular vs. monolithic design)

8. Industry Trends Analysis

Current development trends include:

Migration to 56Gbps+ PAM4 signaling protocols
Adoption of hybrid optical/electrical backplane architectures
Integration of embedded monitoring sensors (temperature/vibration)
Implementation of additive manufacturing for complex geometries
Growing demand for RoHS-compliant, halogen-free materials

Market forecasts predict 8.7% CAGR through 2030 driven by 5G infrastructure and AI hardware demands.