Backplane Connectors - Hard Metric, Standard

Image Part Number Description / PDF Quantity Rfq
HM2J71PEE128N9LF

HM2J71PEE128N9LF

Storage & Server IO (Amphenol ICC)

CONN HEADER 114POS 2MM PRESS-FIT

0

HM2R70PA5108E9LF

HM2R70PA5108E9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 132POS 2MM PRESS-FIT

0

HM2S02PE5101N9LF

HM2S02PE5101N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 125POS 2MM PRESS-FIT

0

HM2J09PE5168N9LF

HM2J09PE5168N9LF

Storage & Server IO (Amphenol ICC)

CONN HEADER 66POS 2MM PRESS-FIT

0

HM2P65PDT2U0N9LF

HM2P65PDT2U0N9LF

Storage & Server IO (Amphenol ICC)

CONN HEADER 125POS 2MM PRESS-FIT

0

10155105-102LF

10155105-102LF

Storage & Server IO (Amphenol ICC)

MILLIPACS HIGH SPEED RA RECEPT

0

HM2R01PA5108N9LF

HM2R01PA5108N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 110POS 2MM PRESS-FIT

537

HM2P87PD8111N9LF

HM2P87PD8111N9LF

Storage & Server IO (Amphenol ICC)

CONN HEADER 220POS 2MM PRESS-FIT

192

10155107-101LF

10155107-101LF

Storage & Server IO (Amphenol ICC)

MILLIPACS HIGH SPEED RA RECEPT

0

HM2R01PA5100N9LF

HM2R01PA5100N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 110POS 2MM PRESS-FIT

557

10127169-101LF

10127169-101LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 66POS 2MM PRESS-FIT

72

HM2R10PA5108E9LF

HM2R10PA5108E9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 110POS 2MM PRESS-FIT

288

HM2P08PKH3E5GFLLF

HM2P08PKH3E5GFLLF

Storage & Server IO (Amphenol ICC)

CONN HEADER 150POS 2MM PRESS-FIT

0

HM2P08PDP2N5N9LF

HM2P08PDP2N5N9LF

Storage & Server IO (Amphenol ICC)

CONN HEADER 150POS 2MM PRESS-FIT

0

HM2P08PDE129N9LF

HM2P08PDE129N9LF

Storage & Server IO (Amphenol ICC)

CONN HEADER 150POS 2MM PRESS-FIT

0

HM2R81PA8108N9LF

HM2R81PA8108N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 176POS 2MM PRESS-FIT

0

HM2R01PE5100N9LF

HM2R01PE5100N9LF

Storage & Server IO (Amphenol ICC)

CONN HARD METRIC

0

HM2P07PK5110GFLF

HM2P07PK5110GFLF

Storage & Server IO (Amphenol ICC)

CONN HEADER 110POS 2MM PRESS-FIT

0

HM2P08PDP285N9L1LF

HM2P08PDP285N9L1LF

Storage & Server IO (Amphenol ICC)

CONN HEADER 150POS 2MM PRESS-FIT

0

HM2P07PDG1A1N9LF

HM2P07PDG1A1N9LF

Storage & Server IO (Amphenol ICC)

CONN HEADER 154POS 2MM PRESS-FIT

1152

Backplane Connectors - Hard Metric, Standard

1. Overview

Hard Metric Standard Backplane Connectors are precision-engineered electrical components designed for high-density interconnection in complex systems. Defined by their standardized 2.54mm (0.1") grid spacing, these connectors ensure mechanical and electrical compatibility across generations of equipment. Their importance in modern technology stems from enabling scalable, high-reliability architectures in telecommunications, industrial automation, and mission-critical computing systems.

2. Main Types & Functional Classification

TypeKey FeaturesApplications
2.54mm Hard MetricStandardized pitch, 1-6 rows, up to 60A per contactTelecom switches, industrial controllers
2.00mm Hard MetricReduced pitch, enhanced vibration resistanceHigh-density servers, medical imaging
1.27mm Hard MetricUltra-high density, low insertion forceCompact test equipment, aerospace systems

3. Structure & Composition

Typical construction includes: - Insulating housing (LCP/nylon with high thermal stability) - Contact array (phosphor bronze with gold/silver plating) - Polarization keying for mating assurance - EMI shielding via integrated metal frames - Actuation mechanism (lever-assisted or push-pull variants)

4. Key Technical Specifications

ParameterTypical ValueImportance
Current Rating1-60A per contactDetermines power delivery capacity
Contact Resistance 5m Impacts signal integrity
Dielectric Strength1000VACSafety and insulation reliability
Mating Cycles200-2000 cyclesSystem longevity indicator
Operating Temp-55 C to +125 CEnvironmental robustness

5. Application Fields

  • Telecommunications: 5G base stations, optical transport systems
  • Industrial: PLC backplanes, test & measurement equipment
  • Medical: MRI scanners, diagnostic imaging systems
  • Transportation: Rail signaling systems, avionics

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey Features
TE ConnectivityHERMHARD HM2.54mm, 3-row, 3000V isolation
AmphenolHarshIO HMIP67-rated, extreme vibration resistance
MolexMX Hard MetricHigh-speed differential pairs, 25Gbps

7. Selection Guidelines

Key considerations include: - Electrical requirements (current/voltage per contact) - Mechanical constraints (board spacing, mating force) - Environmental conditions (temperature, vibration) - Future scalability (modular design compatibility) - Cost optimization (total lifecycle vs upfront cost)

8. Industry Trends

Emerging developments include: - Integration with optical backplane technology - Increased adoption of 1.27mm pitch for compact systems - Enhanced thermal management solutions - RoHS-compliant plating materials (replacing cadmium) - Smart connectors with integrated diagnostics

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