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Hard Metric Standard Backplane Connectors are precision-engineered electrical components designed for high-density interconnection in complex systems. Defined by their standardized 2.54mm (0.1") grid spacing, these connectors ensure mechanical and electrical compatibility across generations of equipment. Their importance in modern technology stems from enabling scalable, high-reliability architectures in telecommunications, industrial automation, and mission-critical computing systems.
| Type | Key Features | Applications |
|---|---|---|
| 2.54mm Hard Metric | Standardized pitch, 1-6 rows, up to 60A per contact | Telecom switches, industrial controllers |
| 2.00mm Hard Metric | Reduced pitch, enhanced vibration resistance | High-density servers, medical imaging |
| 1.27mm Hard Metric | Ultra-high density, low insertion force | Compact test equipment, aerospace systems |
Typical construction includes: - Insulating housing (LCP/nylon with high thermal stability) - Contact array (phosphor bronze with gold/silver plating) - Polarization keying for mating assurance - EMI shielding via integrated metal frames - Actuation mechanism (lever-assisted or push-pull variants)
| Parameter | Typical Value | Importance |
|---|---|---|
| Current Rating | 1-60A per contact | Determines power delivery capacity |
| Contact Resistance | 5m | Impacts signal integrity |
| Dielectric Strength | 1000VAC | Safety and insulation reliability |
| Mating Cycles | 200-2000 cycles | System longevity indicator |
| Operating Temp | -55 C to +125 C | Environmental robustness |
| Manufacturer | Product Series | Key Features |
|---|---|---|
| TE Connectivity | HERMHARD HM | 2.54mm, 3-row, 3000V isolation |
| Amphenol | HarshIO HM | IP67-rated, extreme vibration resistance |
| Molex | MX Hard Metric | High-speed differential pairs, 25Gbps |
Key considerations include: - Electrical requirements (current/voltage per contact) - Mechanical constraints (board spacing, mating force) - Environmental conditions (temperature, vibration) - Future scalability (modular design compatibility) - Cost optimization (total lifecycle vs upfront cost)
Emerging developments include: - Integration with optical backplane technology - Increased adoption of 1.27mm pitch for compact systems - Enhanced thermal management solutions - RoHS-compliant plating materials (replacing cadmium) - Smart connectors with integrated diagnostics