Backplane Connectors - Hard Metric, Standard

Part Number	Description / PDF	Quantity
17131272201 HARTING	CONN HEADER 127POS 2MM PRESS-FIT	0
17041322201 HARTING	CONN HEADER 132POS 2MM PRESS-FIT	56
17262201102 HARTING	CONN RECEPT 220POS 2MM PRESS-FIT	0
17241101102 HARTING	CONN RECEPT 132POS 2MM PRESS-FIT	0
17011542204 HARTING	CONN HEADER 154POS 2MM PRESS-FIT	73
17041542010 HARTING	CONN HEADER 154POS 2MM PRESS-FIT	11
17051332201 HARTING	CONN HEADER 133POS 2MM PRESS-FIT	202
17461442207 HARTING	CONN HEADER 144POS 2MM PRESS-FIT	18
17011542201 HARTING	CONN HEADER 154POS 2MM PRESS-FIT	316
17041102202 HARTING	CONN HEADER 2MM PRESS-FIT	78
17021752006 HARTING	CONN HEADER 175POS 2MM PRESS-FIT	22
17210902103 HARTING	CONN RECEPT 110POS 2MM PRESS-FIT	38
17230551101 HARTING	CONN RECEPT 55POS 2MM PRESS-FIT	79
17011102201 HARTING	CONN HEADER 110POS 2MM PRESS-FIT	90
17241102101 HARTING	CONN RECEPT 110POS 2MM PRESS-FIT	37
17051331602 HARTING	CONN HEADER 133POS 2MM PRESS-FIT	6
17050951201 HARTING	CONN HEADER 95POS 2MM PRESS-FIT	39
17021751201 HARTING	CONN HEADER 175POS 2MM PRESS-FIT	60
17011541604 HARTING	CONN HEADER 154POS 2MM PRESS-FIT	6
17211102101 HARTING	CONN RECEPT 110POS 2MM PRESS-FIT	38

Backplane Connectors - Hard Metric, Standard

1. Overview

Hard Metric Standard Backplane Connectors are precision-engineered electrical components designed for high-density interconnection in complex systems. Defined by their standardized 2.54mm (0.1") grid spacing, these connectors ensure mechanical and electrical compatibility across generations of equipment. Their importance in modern technology stems from enabling scalable, high-reliability architectures in telecommunications, industrial automation, and mission-critical computing systems.

2. Main Types & Functional Classification

Type	Key Features	Applications
2.54mm Hard Metric	Standardized pitch, 1-6 rows, up to 60A per contact	Telecom switches, industrial controllers
2.00mm Hard Metric	Reduced pitch, enhanced vibration resistance	High-density servers, medical imaging
1.27mm Hard Metric	Ultra-high density, low insertion force	Compact test equipment, aerospace systems

3. Structure & Composition

Typical construction includes: - Insulating housing (LCP/nylon with high thermal stability) - Contact array (phosphor bronze with gold/silver plating) - Polarization keying for mating assurance - EMI shielding via integrated metal frames - Actuation mechanism (lever-assisted or push-pull variants)

4. Key Technical Specifications

Parameter	Typical Value	Importance
Current Rating	1-60A per contact	Determines power delivery capacity
Contact Resistance	5m	Impacts signal integrity
Dielectric Strength	1000VAC	Safety and insulation reliability
Mating Cycles	200-2000 cycles	System longevity indicator
Operating Temp	-55 C to +125 C	Environmental robustness

5. Application Fields

Telecommunications: 5G base stations, optical transport systems
Industrial: PLC backplanes, test & measurement equipment
Medical: MRI scanners, diagnostic imaging systems
Transportation: Rail signaling systems, avionics

6. Leading Manufacturers & Products

Manufacturer	Product Series	Key Features
TE Connectivity	HERMHARD HM	2.54mm, 3-row, 3000V isolation
Amphenol	HarshIO HM	IP67-rated, extreme vibration resistance
Molex	MX Hard Metric	High-speed differential pairs, 25Gbps

7. Selection Guidelines

Key considerations include: - Electrical requirements (current/voltage per contact) - Mechanical constraints (board spacing, mating force) - Environmental conditions (temperature, vibration) - Future scalability (modular design compatibility) - Cost optimization (total lifecycle vs upfront cost)

8. Industry Trends

Emerging developments include: - Integration with optical backplane technology - Increased adoption of 1.27mm pitch for compact systems - Enhanced thermal management solutions - RoHS-compliant plating materials (replacing cadmium) - Smart connectors with integrated diagnostics