Backplane Connectors - Hard Metric, Standard

Image Part Number Description / PDF Quantity Rfq
17041102201

17041102201

HARTING

CONN HEADER 110POS 2MM PRESS-FIT

22

254963

254963

ERNI Electronics

2MM HM 6POS M PWR MOD MMMMMM CL1

136

17062202201

17062202201

HARTING

CONN HEADER 220POS 2MM PRESS-FIT

18

17021752201

17021752201

HARTING

CONN HEADER 175POS 2MM PRESS-FIT

30

646346-1

646346-1

TE Connectivity AMP Connectors

CONN HEADER 176POS 2MM PRESS-FIT

0

17211101101

17211101101

HARTING

CONN RECEPT 110POS 2MM PRESS-FIT

29

923131

923131

ERNI Electronics

2MM HM B22 154POS M

736

104112

104112

ERNI Electronics

2MM HM A 110POS F VERT 3.7MM

223

114112

114112

ERNI Electronics

2MM HM B19 95POS F VERT SHLD

220

114400

114400

ERNI Electronics

2MM HM 3POS M PWR MOD LLL

202

HM2R81PA8100N9LF

HM2R81PA8100N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 176POS 2MM PRESS-FIT

0

1857995-1

1857995-1

TE Connectivity AMP Connectors

CONN RECEPT 125POS 2MM PRESS-FIT

0

HM2P08PKE125GFLF

HM2P08PKE125GFLF

Storage & Server IO (Amphenol ICC)

CONN HEADER 150POS 2MM PRESS-FIT

0

17050952202

17050952202

HARTING

CONN HEADER 2MM PRESS-FIT

0

HM2R30PE5108N9LF

HM2R30PE5108N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 55POS 2MM PRESS-FIT

0

5188516-9

5188516-9

TE Connectivity AMP Connectors

CONN HEADER 77POS 2MM PRESS-FIT

226

17341101101

17341101101

HARTING

CONN RECEPT 110POS 2MM PRESS-FIT

34

HM2R70PA5101N9LF

HM2R70PA5101N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 132POS 2MM PRESS-FIT

0

HM2R87PA8101AALF

HM2R87PA8101AALF

Storage & Server IO (Amphenol ICC)

MPACS 8R RA REC

0

HM2R30PA5101N9LF

HM2R30PA5101N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 55POS 2MM PRESS-FIT

0

Backplane Connectors - Hard Metric, Standard

1. Overview

Hard Metric Standard Backplane Connectors are precision-engineered electrical components designed for high-density interconnection in complex systems. Defined by their standardized 2.54mm (0.1") grid spacing, these connectors ensure mechanical and electrical compatibility across generations of equipment. Their importance in modern technology stems from enabling scalable, high-reliability architectures in telecommunications, industrial automation, and mission-critical computing systems.

2. Main Types & Functional Classification

TypeKey FeaturesApplications
2.54mm Hard MetricStandardized pitch, 1-6 rows, up to 60A per contactTelecom switches, industrial controllers
2.00mm Hard MetricReduced pitch, enhanced vibration resistanceHigh-density servers, medical imaging
1.27mm Hard MetricUltra-high density, low insertion forceCompact test equipment, aerospace systems

3. Structure & Composition

Typical construction includes: - Insulating housing (LCP/nylon with high thermal stability) - Contact array (phosphor bronze with gold/silver plating) - Polarization keying for mating assurance - EMI shielding via integrated metal frames - Actuation mechanism (lever-assisted or push-pull variants)

4. Key Technical Specifications

ParameterTypical ValueImportance
Current Rating1-60A per contactDetermines power delivery capacity
Contact Resistance 5m Impacts signal integrity
Dielectric Strength1000VACSafety and insulation reliability
Mating Cycles200-2000 cyclesSystem longevity indicator
Operating Temp-55 C to +125 CEnvironmental robustness

5. Application Fields

  • Telecommunications: 5G base stations, optical transport systems
  • Industrial: PLC backplanes, test & measurement equipment
  • Medical: MRI scanners, diagnostic imaging systems
  • Transportation: Rail signaling systems, avionics

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey Features
TE ConnectivityHERMHARD HM2.54mm, 3-row, 3000V isolation
AmphenolHarshIO HMIP67-rated, extreme vibration resistance
MolexMX Hard MetricHigh-speed differential pairs, 25Gbps

7. Selection Guidelines

Key considerations include: - Electrical requirements (current/voltage per contact) - Mechanical constraints (board spacing, mating force) - Environmental conditions (temperature, vibration) - Future scalability (modular design compatibility) - Cost optimization (total lifecycle vs upfront cost)

8. Industry Trends

Emerging developments include: - Integration with optical backplane technology - Increased adoption of 1.27mm pitch for compact systems - Enhanced thermal management solutions - RoHS-compliant plating materials (replacing cadmium) - Smart connectors with integrated diagnostics

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