Backplane Connectors - Hard Metric, Standard

Image Part Number Description / PDF Quantity Rfq
HM2R87PA8100N9LF

HM2R87PA8100N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 176POS 2MM PRESS-FIT

0

HM2P65PDE1R0N9L1LF

HM2P65PDE1R0N9L1LF

Storage & Server IO (Amphenol ICC)

CONN HEADER 125POS 2MM PRESS-FIT

0

10148426-101LF

10148426-101LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 125POS 2MM PRESS-FIT

68

17050952201

17050952201

HARTING

CONN HEADER 95POS 2MM PRESS-FIT

30

17151692201

17151692201

HARTING

CONN HEADER 169POS 2MM PRESS-FIT

1

352131-1

352131-1

TE Connectivity AMP Connectors

CONN HEADER 110POS 2MM PRESS-FIT

159

124096

124096

ERNI Electronics

2MM HM E 200POS F VERT 3.7MM

160

5106414-1

5106414-1

TE Connectivity AMP Connectors

CONN HEADER 125POS 2MM PRESS-FIT

0

5106012-1

5106012-1

TE Connectivity AMP Connectors

CONN HEADER 55POS 2MM PRESS-FIT

737

5646446-1

5646446-1

TE Connectivity AMP Connectors

CONN RECEPT 88POS 2MM PRESS-FIT

736

3-100143-0

3-100143-0

TE Connectivity AMP Connectors

CONN HEADER 110POS 2MM PRESS-FIT

143

5188399-1

5188399-1

TE Connectivity AMP Connectors

CONN HEADER 154POS 2MM PRESS-FIT

801

CP2-SA110-1-FJ

CP2-SA110-1-FJ

3M

CONN RECEPT 110POS 2MM PRESS-FIT

0

HM2R10PA5101N9LF

HM2R10PA5101N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 110POS 2MM PRESS-FIT

0

CP2-HC055-GF1-KR

CP2-HC055-GF1-KR

3M

CONN HEADER 77POS 2MM PRESS-FIT

0

104935

104935

ERNI Electronics

2MM HM D 176POS F SHLD NO PEG

160

5352171-1

5352171-1

TE Connectivity AMP Connectors

CONN RECEPT 95POS 2MM PRESS-FIT

1304

HM2R70PA5108AALF

HM2R70PA5108AALF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 132POS 2MM PRESS-FIT

0

352359-1

352359-1

TE Connectivity AMP Connectors

CONN RECEPT 110POS 2MM PRESS-FIT

0

1857990-1

1857990-1

TE Connectivity AMP Connectors

CONN RECEPT 125POS 2MM PRESS-FIT

164

Backplane Connectors - Hard Metric, Standard

1. Overview

Hard Metric Standard Backplane Connectors are precision-engineered electrical components designed for high-density interconnection in complex systems. Defined by their standardized 2.54mm (0.1") grid spacing, these connectors ensure mechanical and electrical compatibility across generations of equipment. Their importance in modern technology stems from enabling scalable, high-reliability architectures in telecommunications, industrial automation, and mission-critical computing systems.

2. Main Types & Functional Classification

TypeKey FeaturesApplications
2.54mm Hard MetricStandardized pitch, 1-6 rows, up to 60A per contactTelecom switches, industrial controllers
2.00mm Hard MetricReduced pitch, enhanced vibration resistanceHigh-density servers, medical imaging
1.27mm Hard MetricUltra-high density, low insertion forceCompact test equipment, aerospace systems

3. Structure & Composition

Typical construction includes: - Insulating housing (LCP/nylon with high thermal stability) - Contact array (phosphor bronze with gold/silver plating) - Polarization keying for mating assurance - EMI shielding via integrated metal frames - Actuation mechanism (lever-assisted or push-pull variants)

4. Key Technical Specifications

ParameterTypical ValueImportance
Current Rating1-60A per contactDetermines power delivery capacity
Contact Resistance 5m Impacts signal integrity
Dielectric Strength1000VACSafety and insulation reliability
Mating Cycles200-2000 cyclesSystem longevity indicator
Operating Temp-55 C to +125 CEnvironmental robustness

5. Application Fields

  • Telecommunications: 5G base stations, optical transport systems
  • Industrial: PLC backplanes, test & measurement equipment
  • Medical: MRI scanners, diagnostic imaging systems
  • Transportation: Rail signaling systems, avionics

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey Features
TE ConnectivityHERMHARD HM2.54mm, 3-row, 3000V isolation
AmphenolHarshIO HMIP67-rated, extreme vibration resistance
MolexMX Hard MetricHigh-speed differential pairs, 25Gbps

7. Selection Guidelines

Key considerations include: - Electrical requirements (current/voltage per contact) - Mechanical constraints (board spacing, mating force) - Environmental conditions (temperature, vibration) - Future scalability (modular design compatibility) - Cost optimization (total lifecycle vs upfront cost)

8. Industry Trends

Emerging developments include: - Integration with optical backplane technology - Increased adoption of 1.27mm pitch for compact systems - Enhanced thermal management solutions - RoHS-compliant plating materials (replacing cadmium) - Smart connectors with integrated diagnostics

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