Backplane Connectors - Hard Metric, Standard

Image Part Number Description / PDF Quantity Rfq
HM2P08PKP285GFLF

HM2P08PKP285GFLF

Storage & Server IO (Amphenol ICC)

CONN HEADER 150POS 2MM PRESS-FIT

0

17131272201

17131272201

HARTING

CONN HEADER 127POS 2MM PRESS-FIT

0

17041322201

17041322201

HARTING

CONN HEADER 132POS 2MM PRESS-FIT

56

053009

053009

ERNI Electronics

2MM HM C 77POS M 3.7MM

1876

104933

104933

ERNI Electronics

2MM HM AB22 110POS F

0

17262201102

17262201102

HARTING

CONN RECEPT 220POS 2MM PRESS-FIT

0

044148

044148

ERNI Electronics

2MM HM A 110POS M 3.7MM

95

5352068-9

5352068-9

TE Connectivity AMP Connectors

CONN RECEPT 110POS 2MM PRESS-FIT

47

103749

103749

ERNI Electronics

2MM HM C 77POS M 3.7MM

128

5100141-1

5100141-1

TE Connectivity AMP Connectors

CONN HEADER 125POS 2MM PRESS-FIT

284

CP2-SA110-G1-KR

CP2-SA110-G1-KR

3M

CONN RECEPT 110POS 2MM PRESS-FIT

0

HM2S10PE5100N9LF

HM2S10PE5100N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 110POS 2MM PRESS-FIT

379

17241101102

17241101102

HARTING

CONN RECEPT 132POS 2MM PRESS-FIT

0

HM2R87PA8101N9LF

HM2R87PA8101N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 176POS 2MM PRESS-FIT

0

914793

914793

ERNI Electronics

2MM HM B19 133POS M 16MM

160

HM2R01PA5102N9LF

HM2R01PA5102N9LF

Storage & Server IO (Amphenol ICC)

CONN RECEPT 110POS 2MM PRESS-FIT

0

17011542204

17011542204

HARTING

CONN HEADER 154POS 2MM PRESS-FIT

73

17041542010

17041542010

HARTING

CONN HEADER 154POS 2MM PRESS-FIT

11

5352359-1

5352359-1

TE Connectivity AMP Connectors

CONN RECEPT 110POS 2MM PRESS-FIT

65

5106014-1

5106014-1

TE Connectivity AMP Connectors

CONN HEADER 125POS 2MM PRESS-FIT

154

Backplane Connectors - Hard Metric, Standard

1. Overview

Hard Metric Standard Backplane Connectors are precision-engineered electrical components designed for high-density interconnection in complex systems. Defined by their standardized 2.54mm (0.1") grid spacing, these connectors ensure mechanical and electrical compatibility across generations of equipment. Their importance in modern technology stems from enabling scalable, high-reliability architectures in telecommunications, industrial automation, and mission-critical computing systems.

2. Main Types & Functional Classification

TypeKey FeaturesApplications
2.54mm Hard MetricStandardized pitch, 1-6 rows, up to 60A per contactTelecom switches, industrial controllers
2.00mm Hard MetricReduced pitch, enhanced vibration resistanceHigh-density servers, medical imaging
1.27mm Hard MetricUltra-high density, low insertion forceCompact test equipment, aerospace systems

3. Structure & Composition

Typical construction includes: - Insulating housing (LCP/nylon with high thermal stability) - Contact array (phosphor bronze with gold/silver plating) - Polarization keying for mating assurance - EMI shielding via integrated metal frames - Actuation mechanism (lever-assisted or push-pull variants)

4. Key Technical Specifications

ParameterTypical ValueImportance
Current Rating1-60A per contactDetermines power delivery capacity
Contact Resistance 5m Impacts signal integrity
Dielectric Strength1000VACSafety and insulation reliability
Mating Cycles200-2000 cyclesSystem longevity indicator
Operating Temp-55 C to +125 CEnvironmental robustness

5. Application Fields

  • Telecommunications: 5G base stations, optical transport systems
  • Industrial: PLC backplanes, test & measurement equipment
  • Medical: MRI scanners, diagnostic imaging systems
  • Transportation: Rail signaling systems, avionics

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey Features
TE ConnectivityHERMHARD HM2.54mm, 3-row, 3000V isolation
AmphenolHarshIO HMIP67-rated, extreme vibration resistance
MolexMX Hard MetricHigh-speed differential pairs, 25Gbps

7. Selection Guidelines

Key considerations include: - Electrical requirements (current/voltage per contact) - Mechanical constraints (board spacing, mating force) - Environmental conditions (temperature, vibration) - Future scalability (modular design compatibility) - Cost optimization (total lifecycle vs upfront cost)

8. Industry Trends

Emerging developments include: - Integration with optical backplane technology - Increased adoption of 1.27mm pitch for compact systems - Enhanced thermal management solutions - RoHS-compliant plating materials (replacing cadmium) - Smart connectors with integrated diagnostics

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