Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
86094168314758V1LF

86094168314758V1LF

Storage & Server IO (Amphenol ICC)

CONN DIN RCPT 48POS PCB GOLD

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86093967814H55UMLF

86093967814H55UMLF

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CONN DIN HDR 96POS PCB GOLD

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BPS8B96FLD000Z1LF

BPS8B96FLD000Z1LF

Storage & Server IO (Amphenol ICC)

CONN DIN RCPT 96POS IN-LINE GOLD

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86093967824765E1LF

86093967824765E1LF

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DIN STRAIGHT HEADER F

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86092325313755QFLF

86092325313755QFLF

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CONN DIN HDR 32POS PCB RA GOLD

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86094327814748E1LF

86094327814748E1LF

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CONN DIN HDR 96POS PCB GOLD

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86093968813H55FTLF

86093968813H55FTLF

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DIN REC RA WITH ALGNR

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86091325113765E1LF

86091325113765E1LF

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CONN DIN HDR 64POS PCB RA GOLD

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8609324G815755E1LF

8609324G815755E1LF

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CONN DIN HDR 32POS PCB GOLD

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86094167313788ELF

86094167313788ELF

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CONN DIN HDR 48POS PCB RA GOLD

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86093488309785E1LF

86093488309785E1LF

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CONN DIN RCPT 48POS PCB GOLD

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86093487814768ELF

86093487814768ELF

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CONN DIN HDR 96POS PCB GOLD

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86094187113760SULF

86094187113760SULF

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DIN RA HEADER F

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86092648124755V1LF

86092648124755V1LF

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CONN DIN RCPT 96POS PCB GOLD

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BPS8B21FLD0C0Z1LF

BPS8B21FLD0C0Z1LF

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CONN DIN RCPT 21POS IN-LINE GOLD

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86094647814H55ELF

86094647814H55ELF

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CONN DIN HDR 96POS PCB GOLD

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86094648115755E1LF

86094648115755E1LF

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DIN TYPEC W/W REC LF CNR

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86092647113755E1LF

86092647113755E1LF

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DIN STRAIGHT HEADER F

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86094647194765E1LF

86094647194765E1LF

Storage & Server IO (Amphenol ICC)

CONN DIN HDR 96POS PCB RA GOLD

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BPS8B96KKD200ECLF

BPS8B96KKD200ECLF

Storage & Server IO (Amphenol ICC)

CONN DIN RCPT 96POS GOLD

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Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

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