Backplane Connectors

Backplane Connectors - DIN 41612

Part Number	Description / PDF	Quantity
86094328314755V1LF Storage & Server IO (Amphenol ICC)	CONN DIN RCPT 48POS PCB GOLD	784
BPS8B96FLD2C0Z1LF Storage & Server IO (Amphenol ICC)	CONN DIN RCPT 96POS IN-LINE GOLD	213
86093967113H55ELF Storage & Server IO (Amphenol ICC)	CONN DIN HDR 96POS PCB RA GOLD	359
86093968813765V1LF Storage & Server IO (Amphenol ICC)	CONN DIN RCPT 96POS PCB RA GOLD	340
86094647113H55ELF Storage & Server IO (Amphenol ICC)	CONN DIN HDR 96POS PCB RA GOLD	281
86093488613755E1LF Storage & Server IO (Amphenol ICC)	CONN DIN RCPT 48POS PCB RA GOLD	151
86093967113T55F1LF Storage & Server IO (Amphenol ICC)	CONN DIN HDR 96POS BRD EDGE RA	137
86094648194755E3LF Storage & Server IO (Amphenol ICC)	CONN DIN RCPT 96POS PCB GOLD	192
86094647113765E1LF Storage & Server IO (Amphenol ICC)	CONN DIN HDR 96POS PCB RA GOLD	800
8609360C113755E1LF Storage & Server IO (Amphenol ICC)	CONN DIN HDR 64POS PCB RA GOLD	92
86093967894755E1LF Storage & Server IO (Amphenol ICC)	CONN DIN HDR 96POS PCB GOLD	81
86093488314755V1LF Storage & Server IO (Amphenol ICC)	CONN DIN RCPT 48POS PCB GOLD	373
86093968124755V1LF Storage & Server IO (Amphenol ICC)	CONN DIN RCPT 96POS PCB GOLD	438
86092646124755V1LF Storage & Server IO (Amphenol ICC)	CONN DIN RCPT 64POS PCB GOLD	340
86094647113T55F1LF Storage & Server IO (Amphenol ICC)	CONN DIN HDR 96POS PCB RA GOLD	178
86094327313755E1LF Storage & Server IO (Amphenol ICC)	CONN DIN HDR 48POS PCB RA GOLD	0
86093967113H55UMLF Storage & Server IO (Amphenol ICC)	CONN DIN HDR 96POS PCB RA GOLD	0
86093968114755V1LF Storage & Server IO (Amphenol ICC)	CONN DIN RCPT 96POS PCB GOLD	561
86094328314T55F1LF Storage & Server IO (Amphenol ICC)	CONN DIN RCPT 48POS PCB GOLD	1323
86092645113755E1LF Storage & Server IO (Amphenol ICC)	CONN DIN HDR 64POS PCB RA GOLD	299

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

Type	Function	Application Examples
Type A	Rectangular contacts, 3.2mm pitch	General-purpose industrial equipment
Type B	Double-ended contacts for PCB stacking	Telecom switching systems
Type C	High-density 2.54mm pitch contacts	Data center servers
Type F	Shielded contacts for high-speed signals	Industrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

Parameter	Value Range	Importance
Current Rating	1-5A per contact	Determines power transmission capacity
Contact Resistance	10m	Affects signal integrity
Operating Voltage	50-250V AC	Safety and insulation requirement
Temperature Range	-40 C to +125 C	Environmental reliability
Insertion Force	2-10N per contact	Assembly and maintenance consideration

5. Application Fields

Telecommunications: Switching systems, routers
Industrial Automation: PLC controllers, CNC machines
Computer Systems: Server racks, mainframe computers
Medical Equipment: Diagnostic imaging systems
Transportation: Railway signaling systems

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Feature
Amphenol	DIN41612R32-032	32-position high-vibration resistance
TE Connectivity	1-1416128	Shielded Type F connector
Samtec	DIN-41612-3MM	3mm pitch miniaturized design
Weidm ller	1846030000	Corrosion-resistant industrial version

7. Selection Guidelines

Determine current/voltage requirements based on system power budget
Select contact pitch according to PCB space constraints
Consider environmental factors (temperature, humidity, vibration)
Verify compatibility with existing backplane standards
Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities