Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
XC4K-1542

XC4K-1542

Omron Electronics Components

CONN DIN PLUG 15POS PCB RA

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XC5E-4423

XC5E-4423

Omron Electronics Components

CONN DIN PLUG 44POS PCB GOLD

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XC5B3241BYOMR

XC5B3241BYOMR

Omron Electronics Components

CONN DIN RCPT 32POS PCB

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XC5K16314ABYOMR

XC5K16314ABYOMR

Omron Electronics Components

CONN DIN PLUG 16POS PCB

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XC5B50410BYOMR

XC5B50410BYOMR

Omron Electronics Components

CONN DIN RCPT 50POS PCB

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XC5C9642ABYOMR

XC5C9642ABYOMR

Omron Electronics Components

CONN DIN PLUG 96POS PCB RA

0

XC5F64422BYOMR

XC5F64422BYOMR

Omron Electronics Components

CONN DIN RCPT 64POS PCB RA GOLD

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XC5K-3231-3A

XC5K-3231-3A

Omron Electronics Components

CONN DIN PLUG 32POS PCB GOLD

0

XC2A-6412

XC2A-6412

Omron Electronics Components

CONN DIN PLUG 64POS PCB RA

0

XC4G-3212

XC4G-3212

Omron Electronics Components

CONN DIN PLUG 32POS PCB RA

0

XC5C-4882-1A

XC5C-4882-1A

Omron Electronics Components

CONN DIN PLUG 48POS PCB RA GOLD

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XC5F-3032-2

XC5F-3032-2

Omron Electronics Components

CONN DIN RCPT 30POS PCB RA GOLD

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XC5K16113ABYOMR

XC5K16113ABYOMR

Omron Electronics Components

CONN DIN PLUG 16POS PCB

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XC5F20322ABYOMR

XC5F20322ABYOMR

Omron Electronics Components

CONN DIN RCPT 20POS PCB RA GOLD

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XC5F01322ABYOMR

XC5F01322ABYOMR

Omron Electronics Components

CONN DIN RCPT 100POS PCB RA GOLD

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XC5F-5032-2A

XC5F-5032-2A

Omron Electronics Components

CONN DIN RCPT 50POS PCB RA GOLD

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XC5F-2632-S032

XC5F-2632-S032

Omron Electronics Components

CONN DIN RCPT 26POS PCB RA GOLD

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XC4L-1546

XC4L-1546

Omron Electronics Components

CONN DIN RCPT 15POS IN-LINE

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XC6D-6421

XC6D-6421

Omron Electronics Components

CONN DIN RCPT 64POS IN-LINE GOLD

0

XC5F20322BYOMR

XC5F20322BYOMR

Omron Electronics Components

CONN DIN RCPT 20POS PCB RA GOLD

0

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

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