Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
268457048002025

268457048002025

Elco (AVX)

CONN DIN RCPT 48POS PCB GOLD

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108478160006025

108478160006025

Elco (AVX)

CONN DIN HDR 160POS PCB GOLD

0

108457160102049

108457160102049

Elco (AVX)

CONN DIN HDR 160POS PCB RA GOLD

0

228457096002049

228457096002049

Elco (AVX)

CONN DIN RCPT 96POS PCB GOLD

0

108483006004025

108483006004025

Elco (AVX)

CONN DIN HDR 16POS PCB RA GOLD

0

268457048011049

268457048011049

Elco (AVX)

CONN DIN RCPT 48POS PCB GOLD

0

208458048001025

208458048001025

Elco (AVX)

CONN DIN RCPT 48POS PCB GOLD

0

108457032001049

108457032001049

Elco (AVX)

CONN DIN HDR 32POS PCB GOLD

0

208457096011061

208457096011061

Elco (AVX)

CONN DIN RCPT 96POS GOLD

0

208477064002025

208477064002025

Elco (AVX)

CONN DIN RCPT 64POS PCB RA GOLD

0

208487064001049

208487064001049

Elco (AVX)

CONN DIN RCPT 64POS PCB GOLD

0

208458128004025

208458128004025

Elco (AVX)

CONN DIN RCPT 128POS PCB GOLD

0

108457096001049

108457096001049

Elco (AVX)

CONN DIN HDR 96POS PCB GOLD

0

108456015001169

108456015001169

Elco (AVX)

CONN DIN HDR 15POS PCB RA GOLD

0

108478048003025

108478048003025

Elco (AVX)

CONN DIN HDR 48POS PCB GOLD

0

228458096002025

228458096002025

Elco (AVX)

CONN DIN RCPT 96POS PCB

0

108487064001025

108487064001025

Elco (AVX)

CONN DIN HDR 64POS PCB RA GOLD

0

108478064001001

108478064001001

Elco (AVX)

CONN DIN HDR 64POS PRESS-FIT GLD

0

208483060003001

208483060003001

Elco (AVX)

CONN DIN RCPT 60POS GOLD

0

208487048002025

208487048002025

Elco (AVX)

CONN DIN RCPT 48POS PCB GOLD

0

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

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