Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
168557096002026

168557096002026

Elco (AVX)

CONN DIN HDR 96POS PCB RA GOLD

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208457096001026

208457096001026

Elco (AVX)

CONN DIN RCPT 96POS PCB GOLD

0

108457064002031

108457064002031

Elco (AVX)

CONN DIN HDR 64POS PCB RA GOLD

0

108457096001026

108457096001026

Elco (AVX)

CONN DIN HDR 96POS PCB GOLD

0

108457064002025

108457064002025

Elco (AVX)

CONN DIN HDR 64POS PCB RA GOLD

2334

208457096001025

208457096001025

Elco (AVX)

CONN DIN RCPT 96POS PCB GOLD

0

208458096001026

208458096001026

Elco (AVX)

CONN DIN RCPT 96POS PCB GOLD

188

208477096002025

208477096002025

Elco (AVX)

CONN DIN RCPT 96POS PCB RA GOLD

43

108458096001026

108458096001026

Elco (AVX)

CONN DIN HDR 96POS PCB RA GOLD

313

128457096002026

128457096002026

Elco (AVX)

CONN DIN HDR 96POS PCB RA GOLD

0

108457096002025

108457096002025

Elco (AVX)

CONN DIN HDR 96POS PCB RA GOLD

313

208447032006025

208447032006025

Elco (AVX)

CONN DIN RCPT 32POS PCB GOLD

0

208448032002025

208448032002025

Elco (AVX)

CONN DIN RCPT 32POS SMD

0

108577096002025

108577096002025

Elco (AVX)

CONN DIN HDR 96POS PCB GOLD

0

108457032002049

108457032002049

Elco (AVX)

CONN DIN HDR 32POS PCB RA GOLD

0

108477128002025

108477128002025

Elco (AVX)

CONN DIN HDR 128POS PCB GOLD

0

208477096002026

208477096002026

Elco (AVX)

CONN DIN RCPT 96POS PCB RA GOLD

0

208457096002026

208457096002026

Elco (AVX)

CONN DIN RCPT 96POS PCB GOLD

0

228458096003025

228458096003025

Elco (AVX)

CONN DIN RCPT 96POS PCB

0

108457032005025

108457032005025

Elco (AVX)

CONN DIN HDR 32POS SMD GOLD

0

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

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