Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
BPS8B96FLD2C0Z1LF

BPS8B96FLD2C0Z1LF

Storage & Server IO (Amphenol ICC)

CONN DIN RCPT 96POS IN-LINE GOLD

213

PCN10HA-50P-2.54DSA(72)

PCN10HA-50P-2.54DSA(72)

Hirose

CONN DIN HDR 50POS PCB GOLD

0

XC5D6421ABYOMR

XC5D6421ABYOMR

Omron Electronics Components

CONN DIN RCPT 64POS

0

09032646821

09032646821

HARTING

CONN DIN RCPT 96POS PCB GOLD

181

XC5A6482BYOMR

XC5A6482BYOMR

Omron Electronics Components

CONN DIN PLUG 64POS PCB RA

0

5536437-4

5536437-4

TE Connectivity AMP Connectors

CONN DIN PLUG 96POS PCB RA GOLD

0

09038646921

09038646921

HARTING

CONN DIN HDR 96POS PCB RA GOLD

0

09062487821

09062487821

HARTING

CONN DIN RCPT 48POS PCB GOLD

12

5650908-5

5650908-5

TE Connectivity AMP Connectors

CONN DIN PLUG 96POS PCB GOLD

1489

09062326821

09062326821

HARTING

CONN DIN RCPT 48POS PNL MNT

59

09022646828

09022646828

HARTING

CONN DIN RCPT 64POS PNL MNT GOLD

12

XC5C-9622E

XC5C-9622E

Omron Electronics Components

CONN DIN PLUG 96POS PCB RA GOLD

0

86093967113H55ELF

86093967113H55ELF

Storage & Server IO (Amphenol ICC)

CONN DIN HDR 96POS PCB RA GOLD

359

XC5A-6422

XC5A-6422

Omron Electronics Components

CONN DIN PLUG 64POS PCB RA GOLD

78

650406-5

650406-5

TE Connectivity AMP Connectors

CONN DIN RCPT 150POS PCB GOLD

0

09063322931

09063322931

HARTING

CONN DIN HDR 48POS PCB RA GOLD

0

09061326931222

09061326931222

HARTING

CONN DIN HDR 48POS PCB RA GOLD

0

PCN10MC-100P-2.54DS(72)

PCN10MC-100P-2.54DS(72)

Hirose

CONN DIN HDR 100POS PCB RA GOLD

0

364918

364918

ERNI Electronics

DIN CD 128POS M SLDR RA CL2

224

09792966801

09792966801

HARTING

CONN DIN RCPT 96POS PCB RA GOLD

16

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

RFQ BOM Call Skype Email
Top