Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
09041327921

09041327921

HARTING

CONN DIN HDR 32POS PCB RA GOLD

0

PCN10EB-90P-2.54DS(72)

PCN10EB-90P-2.54DS(72)

Hirose

CONN DIN HDR 90POS PCB RA GOLD

0

09062152892222

09062152892222

HARTING

DIN H15 FEMALE STRAIGHT 15PIN 4

0

XC5A-4482-1A

XC5A-4482-1A

Omron Electronics Components

CONN DIN PLUG 44POS PCB RA GOLD

40

XC5A-2022

XC5A-2022

Omron Electronics Components

CONN DIN PLUG 20POS PCB RA GOLD

0

09721326973

09721326973

HARTING

DIN-SIGNAL Q032MW-6 0C1-2

80

PCN10C-64S-2.54DS(72)

PCN10C-64S-2.54DS(72)

Hirose

CONN DIN RCPT 64POS PCB RA GOLD

24

5148412-5

5148412-5

TE Connectivity AMP Connectors

CONN DIN PLUG 64POS PCB RA GOLD

1013

86092325313755ELF

86092325313755ELF

Storage & Server IO (Amphenol ICC)

CONN DIN HDR 32POS PCB RA GOLD

726

PCN10-128S-2.54DSA(72)

PCN10-128S-2.54DSA(72)

Hirose

CONN DIN RCPT 128POS PCB GOLD

137

09033647921

09033647921

HARTING

CONN DIN HDR 96POS PCB RA

24

5536446-5

5536446-5

TE Connectivity AMP Connectors

CONN DIN RCPT 32POS PCB GOLD

1488

536484-5

536484-5

TE Connectivity AMP Connectors

CONN DIN RCPT 48POS PCB GOLD

150

09060029911

09060029911

HARTING

DIN F SHROUD FOR SCREW FIXING W

0

09061483410

09061483410

HARTING

DIN-POWER F048MC-B

139

650462-5

650462-5

TE Connectivity AMP Connectors

CONN DIN RCPT 96POS PCB RA GOLD

0

XC5E50812BYOMR

XC5E50812BYOMR

Omron Electronics Components

CONN DIN PLUG 50POS

0

09021326932

09021326932

HARTING

CONN DIN HDR 64POS PCB GOLD

0

02071601101

02071601101

HARTING

CONN DIN RCPT 160POS PCB RA GOLD

106

PCN10C-20S-2.54DS(72)

PCN10C-20S-2.54DS(72)

Hirose

CONN DIN RCPT 20POS PCB RA GOLD

325

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

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