Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
9001-36321C00L1A

9001-36321C00L1A

Oupiin

DIN41612, FEMALE, B TYPE, 32 PIN

70

PCN10EA-48P-2.54DS(72)

PCN10EA-48P-2.54DS(72)

Hirose

CONN DIN HDR 48POS PCB RA GOLD

0

9001-16482C00T-S

9001-16482C00T-S

Oupiin

DIN41612, FEMALE, HALF C TYPE, 4

0

PCN10HB-50P-2.54DSA(72)

PCN10HB-50P-2.54DSA(72)

Hirose

CONN DIN HDR 50POS PCB GOLD

0

5650864-5

5650864-5

TE Connectivity AMP Connectors

CONN DIN RCPT 32POS PCB

52

09061326921

09061326921

HARTING

CONN DIN HDR 48POS PCB RA GOLD

18

09036646921

09036646921

HARTING

CONN DIN HDR 96POS PCB RA

194

PCN10A-100P-2.54DS(72)

PCN10A-100P-2.54DS(72)

Hirose

CONN DIN HDR 100POS PCB RA GOLD

0

09061152932

09061152932

HARTING

CONN DIN HDR 15POS PCB RA GOLD

433

86093968114755V1LF

86093968114755V1LF

Storage & Server IO (Amphenol ICC)

CONN DIN RCPT 96POS PCB GOLD

561

09061152991

09061152991

HARTING

CONN DIN HDR 15POS PCB RA GOLD

236

09037646421

09037646421

HARTING

DIN-SIGNAL C064FS-13 0C1-2-COD

0

224408

224408

ERNI Electronics

DIN C 96POS F PFIT 5.5MM CL2

2794

86094328314T55F1LF

86094328314T55F1LF

Storage & Server IO (Amphenol ICC)

CONN DIN RCPT 48POS PCB GOLD

1323

536437-6

536437-6

TE Connectivity AMP Connectors

CONN DIN PLUG 96POS PCB RA GOLD

235

86092645113755E1LF

86092645113755E1LF

Storage & Server IO (Amphenol ICC)

CONN DIN HDR 64POS PCB RA GOLD

299

09032326411

09032326411

HARTING

DIN-SIGNAL C032FP-16 2C1-2

0

09031962951

09031962951

HARTING

CONN DIN HDR 96POS PCB RA GOLD

1

09062482832

09062482832

HARTING

CONN DIN RCPT 48POS PCB

29

5650477-5

5650477-5

TE Connectivity AMP Connectors

CONN DIN PLUG 48POS PCB GOLD

424

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

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