ARINC inserts for backplane connectors are modular interconnect solutions designed to meet aviation and high-reliability industry standards. Defined by ARINC (Aeronautical Radio Inc.) specifications, these connectors provide scalable, high-density electrical connections between printed circuit boards (PCBs) and backplanes. Their importance lies in enabling rapid system maintenance, hot-swapping capabilities, and robust signal integrity in mission-critical applications such as avionics, defense systems, and industrial automation.
| Type | Function Features | Application Examples |
|---|---|---|
| ARINC 404 | Rectangular sealed connectors, 12-100 contacts, environmental sealing | Commercial aircraft avionics racks |
| ARINC 407 | Panel-mountable, quick-disconnect design, 15-124 contacts | Military radar systems |
| ARINC 600 | High-density LRU modules, 128-512 contacts, EMI shielding | Modern flight control computers |
| ARINC 801 | Fiber optic termini, single/multi-channel variants | High-speed data links in UAVs |
Typical ARINC insert assemblies consist of: - Housing: Anodized aluminum or composite materials with keying features - Contact Blocks: Modular inserts with precision-machined copper alloy contacts (gold-plated) - Latching Mechanism: Cam-driven or push-pull coupling systems - Environmental Seals: Silicone gaskets meeting IP67 ratings - EMI Shielding: Conductive elastomer gaskets and metallized coatings
| Parameter | Value Range | Significance |
|---|---|---|
| Current Rating | 1-15A per contact | Determines power handling capability |
| Contact Resistance | 5m | Impacts signal integrity |
| Dielectric Withstanding Voltage | 500-1500VAC | Safety insulation requirement |
| Vibration Resistance | 20G-50G | Ensures stability in harsh environments |
| Temperature Range | -65 C to +200 C | Operational reliability factor |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| TE Connectivity | ARINC 600 Series | 320GB/s data rate support, 512 contacts |
| Amphenol Aerospace | MIL-DTL-38999 | Space-rated variants, 10,000 mating cycles |
| Delphi Connection Systems | Airframe Connectors | Weight-optimized composite shells |
Key considerations include: - Electrical requirements (voltage/current profiles) - Environmental extremes (temperature/vibration) - Mechanical constraints (board spacing, retention force) - Future-proofing (contact density scalability) - Compliance with ARINC 429/664 standards - Cost-effectiveness for volume deployment
Market developments indicate: - Transition to 22Gbps+ high-speed differential signaling - Integration of optical and RF contacts in hybrid modules - Adoption of additive manufacturing for weight reduction - Increased demand for DO-160G compliance variants - Growth in UAV and autonomous vehicle applications - Development of thermoplastic alternatives to metal housings