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Backplane Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
4-1393706-2

4-1393706-2

TE Connectivity AMP Connectors

CONN IDC CABLE CLAMP ASSEMBLY

0
447006-1

447006-1

TE Connectivity AMP Connectors

SHELL ASSY, B SIDE, HDI

0
5-1393706-0

5-1393706-0

TE Connectivity AMP Connectors

CONN IDC CABLE CLAMP ASSEMBLY

0

Backplane Connectors - Accessories

1. Overview

Backplane connectors are critical components in electronic systems, providing modular interconnection between printed circuit boards (PCBs) and supporting high-density signal/power transmission. Accessories enhance their functionality through mechanical support, environmental protection, and performance optimization. These components are essential in telecommunications, data centers, and industrial equipment for ensuring reliable system architecture.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Alignment PinsPrecision-guided insertion, anti-misalignment designTelecom backplanes
Grounding ClipsEMI shielding, 360 contactMilitary radar systems
Dust CoversIP67-rated contamination protectionOutdoor base stations
Mounting BracketsVibration damping, load distributionIndustrial control cabinets
Test AdaptersHot-swappable diagnostics interfaceData center maintenance

3. Structural Composition

Typical construction includes:

  • Mechanical components: Precision-machined alignment guides and stress-relief brackets
  • Electrical elements: Gold-plated contact points and EMI gaskets
  • Material composition: LCP (Liquid Crystal Polymer) insulation with UL94 V-0 rating

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating1-5A per contactPower transmission capability
Dielectric Strength1,000-2,500VACElectrical safety margin
Contact Resistance<10m Signal integrity maintenance
Insertion Force20-80NUsability and durability
Operating Temp-55 C to +125 CEnvironmental reliability

5. Application Fields

Primary industries:

  • Telecommunications: 5G base stations, optical switches
  • Data Centers: Server racks, storage arrays
  • Industrial Automation: PLC backplanes
  • Medical Imaging: MRI scanner chassis interconnects
  • Aerospace: Avionics modular systems

6. Leading Manufacturers & Products

ManufacturerKey Product SeriesTechnical Highlights
TE ConnectivityARINC 800H100Gbps optical integration
AmphenolCBGA SocketZero insertion force design
MolexMX-SERIESSelf-aligning twinax contacts
SamtecRaptor HD25.4 m contact spacing

7. Selection Guidelines

Key considerations:

  • Signal integrity requirements (frequency & skew tolerance)
  • Environmental conditions (temperature/humidity/corrosion)
  • Mechanical durability (mating cycles & vibration resistance)
  • Thermal management (current carrying capacity)
  • Compliance standards (IPC, MIL-STD, RoHS)

Case Study: In hyper-scale data centers, Samtec's FireFly modular system reduced rack interconnect costs by 40% while maintaining 28Gbps performance.

8. Industry Trends

Emerging developments include:

  • High-speed protocols (PCIe 5.0, 112Gbps SerDes)
  • Miniaturization (sub-1mm contact pitch)
  • Smart monitoring integration (embedded sensors)
  • Advanced materials (graphene-enhanced contacts)
  • Sustainable manufacturing (lead-free plating processes)
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