Backplane Connectors - Accessories

Part Number	Description / PDF	Quantity
1469269-2 TE Connectivity AMP Connectors	GUIDE PIN 6MM THREAD LENGTH	478
09068480552 HARTING	DIN-POWER SHELL HOUSING D20 META	0
09069009996 HARTING	DIN-POWER FIXING BRACKET B RIGHT	78
202434-4 TE Connectivity AMP Connectors	CONN PIN HOOD INT 34POS PANEL MT	0
17790000024 HARTING	HAR-BUS HM CODING F RAL6011 RESE	8
8-826199-0 TE Connectivity AMP Connectors	SHIELD ASSY.	50
2033879011 Woodhead - Molex	IMPEL TEST CABLE CROSSOVER	30
203966-1 TE Connectivity AMP Connectors	CONN GUIDE SOCKET CORNER	0
1-1410999-2 TE Connectivity AMP Connectors	CONN GUIDEPIN RT 9MM 2.60	1200
201571-2 TE Connectivity AMP Connectors	CONN SHIELD 34POS 2PC LONG	0
1061051100 Woodhead - Molex	DAUGHTERBOARD ASSY SCRW VERS	100
09060019935 HARTING	DIN-POWER FIXING BRACKET	15
09060009961 HARTING	DIN-POWER MECHANICAL GUIDING	0
201237-2 TE Connectivity AMP Connectors	CONN STRAIN RELIEF 20POS SHORT	0
201443-2 TE Connectivity AMP Connectors	CONN SHIELD 50POS 2PC LONG	111
09069019924 HARTING	DIN-POWER LOCKING LEVER BL20-M	0
201414-4 TE Connectivity AMP Connectors	CONN JACKSCREW LONG FEMALE	30
2226512-1 TE Connectivity Aerospace Defense and Marine	SMPM RF VERT MODULE	6
PCN21-P-CK(D) Hirose	CONN CODING KEY MALE YELLOW 3.3V	0
17790000011 HARTING	HAR-BUS HM CODING M RAL5011 PCEE	590

Backplane Connectors - Accessories

1. Overview

Backplane connectors are critical components in electronic systems, providing modular interconnection between printed circuit boards (PCBs) and supporting high-density signal/power transmission. Accessories enhance their functionality through mechanical support, environmental protection, and performance optimization. These components are essential in telecommunications, data centers, and industrial equipment for ensuring reliable system architecture.

2. Major Types & Functional Classification

Type	Functional Features	Application Examples
Alignment Pins	Precision-guided insertion, anti-misalignment design	Telecom backplanes
Grounding Clips	EMI shielding, 360 contact	Military radar systems
Dust Covers	IP67-rated contamination protection	Outdoor base stations
Mounting Brackets	Vibration damping, load distribution	Industrial control cabinets
Test Adapters	Hot-swappable diagnostics interface	Data center maintenance

3. Structural Composition

Typical construction includes:

Mechanical components: Precision-machined alignment guides and stress-relief brackets
Electrical elements: Gold-plated contact points and EMI gaskets
Material composition: LCP (Liquid Crystal Polymer) insulation with UL94 V-0 rating

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-5A per contact	Power transmission capability
Dielectric Strength	1,000-2,500VAC	Electrical safety margin
Contact Resistance	<10m	Signal integrity maintenance
Insertion Force	20-80N	Usability and durability
Operating Temp	-55 C to +125 C	Environmental reliability

5. Application Fields

Primary industries:

Telecommunications: 5G base stations, optical switches
Data Centers: Server racks, storage arrays
Industrial Automation: PLC backplanes
Medical Imaging: MRI scanner chassis interconnects
Aerospace: Avionics modular systems

6. Leading Manufacturers & Products

Manufacturer	Key Product Series	Technical Highlights
TE Connectivity	ARINC 800H	100Gbps optical integration
Amphenol	CBGA Socket	Zero insertion force design
Molex	MX-SERIES	Self-aligning twinax contacts
Samtec	Raptor HD	25.4 m contact spacing

7. Selection Guidelines

Key considerations:

Signal integrity requirements (frequency & skew tolerance)
Environmental conditions (temperature/humidity/corrosion)
Mechanical durability (mating cycles & vibration resistance)
Thermal management (current carrying capacity)
Compliance standards (IPC, MIL-STD, RoHS)

Case Study: In hyper-scale data centers, Samtec's FireFly modular system reduced rack interconnect costs by 40% while maintaining 28Gbps performance.

8. Industry Trends

Emerging developments include:

High-speed protocols (PCIe 5.0, 112Gbps SerDes)
Miniaturization (sub-1mm contact pitch)
Smart monitoring integration (embedded sensors)
Advanced materials (graphene-enhanced contacts)
Sustainable manufacturing (lead-free plating processes)