Backplane Connectors - Accessories

Part Number	Description / PDF	Quantity
10037909-101LF Storage & Server IO (Amphenol ICC)	CONN ACCY 7.2MM GUIDE MOD RT ANG	0
09060019903 HARTING	DIN-POWER RETAINING FRAME	30
818071000102006 Elco (AVX)	CONN CODING KEY MALE 5.0V BLUE	0
5352112-2 TE Connectivity AMP Connectors	CONN RCPT Z-PACK SHLD 2MM HM PCB	634
5223986-8 TE Connectivity AMP Connectors	CONN KEYED GUIDE MODULE R/A 4-40	695
202383-1 TE Connectivity AMP Connectors	CONN SHIELD 41POS 2PC SHORT	0
09068009946 HARTING	DIN-POWER FIXING BRACKET LEFT D2	7
646502-1 TE Connectivity AMP Connectors	2MM HM DUST PROTECTOR TYPE A/B	3000
249-4517-000 VEAM	DL2 METAL B/S STRT OR R/A	63
249-4518-000 VEAM	DL3 DLM3 METAL BACKSHELL	529
201047-7 TE Connectivity AMP Connectors	CONN GUIDE SOCKET CORNER	0
09060009920 HARTING	DIN-POWER LOCKING SCREW D20/4	0
LMS-01T-TL Amphenol Aerospace Operations	SPLICE HOUSING 1 BAY	172
QR/P18-SB-B Hirose	CONN RECEPT HOUSING 1.5MM 18POS	0
2-2000677-0 TE Connectivity Aerospace Defense and Marine	HOUSING GUIDE MODULE R/A 20.3MM	134
1410548-4 TE Connectivity AMP Connectors	ACCY CONN GUIDE PIN NICKEL	1148
200532-2 TE Connectivity AMP Connectors	CONN SHIELD 50POS 180 SHRT STEEL	3
09060009958 HARTING	DIN-POWER LOCKING SCREW	186
17790000080 HARTING	HAR-BUS HM GUIDE PIN	618
09060009905 HARTING	DIN-POWER FIXING BRACKET A LEFT	40

Backplane Connectors - Accessories

1. Overview

Backplane connectors are critical components in electronic systems, providing modular interconnection between printed circuit boards (PCBs) and supporting high-density signal/power transmission. Accessories enhance their functionality through mechanical support, environmental protection, and performance optimization. These components are essential in telecommunications, data centers, and industrial equipment for ensuring reliable system architecture.

2. Major Types & Functional Classification

Type	Functional Features	Application Examples
Alignment Pins	Precision-guided insertion, anti-misalignment design	Telecom backplanes
Grounding Clips	EMI shielding, 360 contact	Military radar systems
Dust Covers	IP67-rated contamination protection	Outdoor base stations
Mounting Brackets	Vibration damping, load distribution	Industrial control cabinets
Test Adapters	Hot-swappable diagnostics interface	Data center maintenance

3. Structural Composition

Typical construction includes:

Mechanical components: Precision-machined alignment guides and stress-relief brackets
Electrical elements: Gold-plated contact points and EMI gaskets
Material composition: LCP (Liquid Crystal Polymer) insulation with UL94 V-0 rating

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-5A per contact	Power transmission capability
Dielectric Strength	1,000-2,500VAC	Electrical safety margin
Contact Resistance	<10m	Signal integrity maintenance
Insertion Force	20-80N	Usability and durability
Operating Temp	-55 C to +125 C	Environmental reliability

5. Application Fields

Primary industries:

Telecommunications: 5G base stations, optical switches
Data Centers: Server racks, storage arrays
Industrial Automation: PLC backplanes
Medical Imaging: MRI scanner chassis interconnects
Aerospace: Avionics modular systems

6. Leading Manufacturers & Products

Manufacturer	Key Product Series	Technical Highlights
TE Connectivity	ARINC 800H	100Gbps optical integration
Amphenol	CBGA Socket	Zero insertion force design
Molex	MX-SERIES	Self-aligning twinax contacts
Samtec	Raptor HD	25.4 m contact spacing

7. Selection Guidelines

Key considerations:

Signal integrity requirements (frequency & skew tolerance)
Environmental conditions (temperature/humidity/corrosion)
Mechanical durability (mating cycles & vibration resistance)
Thermal management (current carrying capacity)
Compliance standards (IPC, MIL-STD, RoHS)

Case Study: In hyper-scale data centers, Samtec's FireFly modular system reduced rack interconnect costs by 40% while maintaining 28Gbps performance.

8. Industry Trends

Emerging developments include:

High-speed protocols (PCIe 5.0, 112Gbps SerDes)
Miniaturization (sub-1mm contact pitch)
Smart monitoring integration (embedded sensors)
Advanced materials (graphene-enhanced contacts)
Sustainable manufacturing (lead-free plating processes)