TVS - Diodes

Image Part Number Description / PDF Quantity Rfq
SMCJ140CA

SMCJ140CA

Elco (AVX)

TVS DIODE 140V 227V DO214AB

0

GG0402052R542P

GG0402052R542P

Elco (AVX)

TVS DIODE 5V 15.5V 0402

85266

SMBJ140CA

SMBJ140CA

Elco (AVX)

TVS DIODE 140V 227V SMB

1417

SMAJ140CA

SMAJ140CA

Elco (AVX)

TVS DIODE 140V 227V SMA

8797

GG020105100N2P

GG020105100N2P

Elco (AVX)

TVS DIODE 5V 12V 0201

11156

GG0402050R3C2P

GG0402050R3C2P

Elco (AVX)

TVS DIODE 5V 15.5V 0402

396136

SMCJ140A

SMCJ140A

Elco (AVX)

TVS DIODE 140V 227V DO214AB

1325

GG0402060R3C2P

GG0402060R3C2P

Elco (AVX)

TVS DIODE 0402

18376

GG0402055R042P

GG0402055R042P

Elco (AVX)

TVS DIODE 5V 16V 0402

6717

GG040205170N2P

GG040205170N2P

Elco (AVX)

TVS DIODE 5V 10V 0402

145101

SMBJ140A

SMBJ140A

Elco (AVX)

TVS DIODE 140V 227V SMB

3134

MG052S18A400DP

MG052S18A400DP

Elco (AVX)

TVS DIODE 18V 42V 0508

1000

GG040205100N2P

GG040205100N2P

Elco (AVX)

TVS DIODE 5V 12V 0402

57322

TVS - Diodes

1. Overview

Transient Voltage Suppression (TVS) Diodes are semiconductor devices designed to protect sensitive electronics from voltage spikes caused by ESD (electrostatic discharge), lightning, or switching events. By clamping transient voltages to safe levels, TVS diodes ensure circuit reliability in modern electronic systems. Their fast response time (<1ps) and low clamping voltage make them critical components in high-speed data lines, power supplies, and automotive electronics.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Unidirectional TVSSingle-polarity protection, asymmetrical voltage responseDC power lines, automotive systems
Bidirectional TVSSymmetrical protection for AC signalsTelecom interfaces (e.g., RJ45), USB 3.0 Multichannel TVSMultiple protection paths in single packageHDMI ports, DisplayPort interfaces Automotive TVSAEC-Q101 qualified, high surge capabilityECU modules, CAN bus protection

3. Structure and Composition

TVS diodes utilize a PN junction semiconductor structure with optimized doping profiles. Key components include:

  • Silicon epitaxial layer for precise voltage control
  • Passivation layer (SiO2/Nitride) to reduce leakage current
  • Backside metallization for low-inductance packaging
  • DO-214, SOD-123, or WCSP packaging variants

4. Key Technical Specifications

ParameterDescriptionImportance
Breakdown Voltage (Vbr)Minimum voltage where TVS activatesDetermines protection threshold
Clamping Voltage (Vc)Max voltage during transient eventMust be below protected IC's max rating
Peak Pulse Current (Ipp)Maximum surge current handlingDefines robustness against large transients
Response Time (tresp)Time to switch from off to on stateCrucial for ESD protection (typically <1ps)
Leakage Current (Ir)Off-state current at working voltageImpacts power efficiency

5. Application Areas

Major industries and typical equipment:

  • Telecommunications: 5G base stations, optical transceivers
  • Automotive: CAN/LIN bus protection, ADAS sensors
  • Industrial: PLCs, motor drives
  • Consumer Electronics: USB Type-C interfaces, Wi-Fi modules
  • Renewable Energy: Solar inverters, wind turbine controllers

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
LittelfuseSP301x SeriesUSB 3.1 Gen2 protection, 0.35pF capacitance
ON SemiconductorNUP410606-channel ESD protection, 30kV HBM
STMicroelectronicsESDA8401Automotive-grade, 150A surge rating
InfineonESD320Single-line protection, 0.25pF for HDMI 2.1

7. Selection Guidelines

Key considerations:

  • Operating voltage must be below Vbr (typically 1.1 Voper)
  • Clamping voltage should stay under protected IC's maximum ratings
  • Packaging selection based on board space and thermal requirements
  • Environmental factors: temperature range, humidity resistance
  • Compliance with standards (IEC 61000-4-2, ISO 10605)

Example: For a 12V automotive circuit, select a bidirectional TVS with Vbr=15V, Vc<30V, and Ipp>50A to handle load dump events.

8. Industry Trends

Key development directions:

  • Miniaturization: 0201 package (0.6 0.3mm) for mobile devices
  • Integration: Combo devices with filters and shielding
  • Higher robustness: 40kV+ ESD protection for industrial IoT
  • Advanced materials: Silicon carbide (SiC) for high-temperature applications
  • AI-driven selection tools for optimized component matching
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