Tantalum Capacitors

Image Part Number Description / PDF Quantity Rfq
ECS-F1AE225K

ECS-F1AE225K

Panasonic

CAP TANT 2.2UF 20% 10V RADIAL

0

ECS-T1DD226R

ECS-T1DD226R

Panasonic

CAP TANT 22UF 20% 20V 2917

0

ECS-T1DC106R

ECS-T1DC106R

Panasonic

CAP TANT 10UF 20% 20V 2312

0

ECS-T1CY105R

ECS-T1CY105R

Panasonic

CAP TANT 1UF 20% 16V 1206

0

ECS-F1CE686

ECS-F1CE686

Panasonic

CAP TANT 68UF 20% 16V RADIAL

0

ECS-F1AE106K

ECS-F1AE106K

Panasonic

CAP TANT 10UF 20% 10V RADIAL

0

ECS-T1EC106R

ECS-T1EC106R

Panasonic

CAP TANT 10UF 20% 25V 2312

0

ECS-T0JX476R

ECS-T0JX476R

Panasonic

CAP TANT 47UF 20% 6.3V 1411

0

ECS-T1CD686R

ECS-T1CD686R

Panasonic

CAP TANT 68UF 20% 16V 2917

0

ECS-F1AE336K

ECS-F1AE336K

Panasonic

CAP TANT 33UF 20% 10V RADIAL

0

ECS-F1VE155K

ECS-F1VE155K

Panasonic

CAP TANT 1.5UF 20% 35V RADIAL

0

ECS-F1HE155K

ECS-F1HE155K

Panasonic

CAP TANT 1.5UF 20% 50V RADIAL

0

ECS-F1CE476

ECS-F1CE476

Panasonic

CAP TANT 47UF 20% 16V RADIAL

0

ECS-T0JY106R

ECS-T0JY106R

Panasonic

CAP TANT 10UF 20% 6.3V 1206

0

ECS-F1HE475K

ECS-F1HE475K

Panasonic

CAP TANT 4.7UF 20% 50V RADIAL

0

ECS-F1EE336

ECS-F1EE336

Panasonic

CAP TANT 33UF 20% 25V RADIAL

0

ECS-F1EE106K

ECS-F1EE106K

Panasonic

CAP TANT 10UF 20% 25V RADIAL

0

ECS-T0JD107R

ECS-T0JD107R

Panasonic

CAP TANT 100UF 20% 6.3V 2917

0

ECS-H1ED106R

ECS-H1ED106R

Panasonic

CAP TANT 10UF 20% 25V 2917

0

EEJ-L1AD107R

EEJ-L1AD107R

Panasonic

CAP TANT 100UF 20% 10V 2917

0

Tantalum Capacitors

Tantalum capacitors are a type of electrolytic capacitor known for their high capacitance density, stability, and reliability. Utilizing tantalum metal as the anode material, these capacitors form a thin insulating oxide layer as the dielectric, enabling efficient charge storage in compact sizes. Their ability to maintain stable capacitance under varying temperatures and voltages makes them critical components in modern electronics, particularly in applications requiring long-term performance and miniaturization, such as consumer electronics, automotive systems, and medical devices.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Solid Electrolyte Tantalum Capacitors High reliability, low leakage current, and stable performance at elevated temperatures Power supply circuits in smartphones, laptops, and industrial control systems
Wet Electrolyte Tantalum Capacitors High capacitance values, excellent stability over time Aerospace systems, military equipment, and high-reliability energy storage
Polymer Electrolyte Tantalum Capacitors Low equivalent series resistance (ESR), improved safety, and vibration resistance Medical implants (e.g., pacemakers), automotive sensors, and high-frequency circuits

3. Structure and Composition

A typical tantalum capacitor consists of four key components:

  1. Anode: Sintered tantalum metal pellet with porous structure for increased surface area.
  2. Dielectric: A thin layer of tantalum pentoxide (Ta2O5) formed electrochemically on the anode surface.
  3. Electrolyte: Conductive material (solid MnO2, liquid electrolyte, or conductive polymer) serving as the cathode.
  4. Encapsulation: Epoxy resin or ceramic casing for mechanical protection and electrical insulation.

This layered structure ensures high capacitance density while maintaining stability under thermal and electrical stress.

 

4. Key Technical Specifications

Parameter Description Importance
Capacitance (C) Range: 0.1 F to 1000 F Determines energy storage capacity and filtering effectiveness
Rated Voltage (VR) Typically 2.5V to 50V Defines safe operating voltage range without dielectric breakdown
Leakage Current Typically < 0.01 C VR A Affects circuit efficiency and long-term reliability
Equivalent Series Resistance (ESR) 0.1 to 10 (varies by type) Impacts high-frequency performance and thermal dissipation
Operating Temperature Range -55 C to +125 C Determines suitability for industrial and automotive applications

5. Application Fields

  • Consumer Electronics: Mobile phones (decoupling circuits), laptops (power management), and wearable devices.
  • Automotive: Engine control units (ECUs), ADAS sensors, and infotainment systems.
  • Medical Devices: Pacemakers, defibrillators, and diagnostic imaging equipment.
  • Aerospace: Avionics systems, satellite power supplies, and radar equipment.

6. Leading Manufacturers and Representative Products

Manufacturer Product Series Key Features
AVX Corporation TAJ Series Low ESR polymer capacitors for high-frequency applications
KEMET Electronics T511 Series Military-grade wet electrolyte capacitors with extended lifespan
Vishay Intertechnology TVCQ Series Automotive-qualified capacitors with AEC-Q200 compliance

7. Selection Guidelines

Key factors to consider when selecting tantalum capacitors:

  1. Operating Conditions: Ensure rated voltage exceeds circuit requirements by 20-50% to prevent voltage spikes.
  2. Temperature Requirements: Choose appropriate dielectric materials for extreme temperature environments.
  3. Size Constraints: Polymer electrolyte types offer lower ESR in smaller packages for space-limited designs.
  4. Reliability Needs: Prioritize hermetically sealed packages for mission-critical applications (e.g., aerospace).
  5. Cost vs. Performance: Solid electrolyte capacitors provide optimal cost-effectiveness for general electronics.

Always verify compliance with industry standards such as MIL-PRF-55365 for military use or AEC-Q200 for automotive applications.

 

8. Industry Trends and Future Outlook

Key development trends include:

  • Miniaturization: Advancements in powder sintering technology enable 0603/0402 package sizes with capacitance above 100 F.
  • High-Temperature Stability: New dielectric materials extend operational limits to 200 C for EV and 5G infrastructure.
  • ESR Reduction: Conductive polymer electrolytes now achieve ESR below 10m for high-efficiency power systems.
  • Environmental Compliance: Lead-free terminations and RoHS-compliant encapsulation materials becoming standard.
  • Integration: Embedded tantalum capacitors in SiP (System-in-Package) modules for advanced computing.

The global market is projected to grow at 6.2% CAGR through 2030, driven by demand in IoT devices, electric vehicles, and medical electronics.

 

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