Tantalum Capacitors

Part Number	Description / PDF	Quantity
THF106K035P1F-F Cornell Dubilier Electronics	CAP TANT 10UF 10% 35V AXIAL	35
TDC105K035NSE-F Cornell Dubilier Electronics	CAP TANT 1UF 10% 35V RADIAL	1
TDC475K020NSE-F Cornell Dubilier Electronics	CAP TANT 4.7UF 10% 20V RADIAL	67
TIM336K010P0Y Cornell Dubilier Electronics	CAP TANT 33UF 10% 10V RADIAL	0
TAS155K075P1C Cornell Dubilier Electronics	CAP TANT 1.5UF 10% 75V AXIAL	0
T491D227K006AS-F Cornell Dubilier Electronics	CAP TANT 220UF 10% 6V 2917	0
TAS476K020P1F Cornell Dubilier Electronics	CAP TANT 47UF 10% 20V AXIAL	0
TDC107K020WSG-F Cornell Dubilier Electronics	CAP TANT 100UF 10% 20V RADIAL	0
TDC106M035NSF-F Cornell Dubilier Electronics	CAP TANT 10UF 20% 35V RADIAL	0
THF157K015P1G-F Cornell Dubilier Electronics	CAP TANT 150UF 10% 15V AXIAL	0
TAC475K035P05 Cornell Dubilier Electronics	CAP TANT 4.7UF 10% 35V AXIAL	0
TIM106K035P0Y Cornell Dubilier Electronics	CAP TANT 10UF 10% 35V RADIAL	0
TDC107M020WSG-F Cornell Dubilier Electronics	CAP TANT 100UF 20% 20V RADIAL	0
TDC156K020NSF-F Cornell Dubilier Electronics	CAP TANT 15UF 10% 20V RADIAL	0
THF157K015P1G Cornell Dubilier Electronics	CAP TANT 150UF 10% 15V AXIAL	0
TDL476K035M1F Cornell Dubilier Electronics	CAP TANT 47UF 10% 35V RADIAL	0
TAC106K015P05 Cornell Dubilier Electronics	CAP TANT 10UF 10% 15V AXIAL	0
TDC565K025NSF-F Cornell Dubilier Electronics	CAP TANT 5.6UF 10% 25V RADIAL	0
TDL106K016S1C Cornell Dubilier Electronics	CAP TANT 10UF 10% 16V RADIAL	0
TAC225K025P02-F Cornell Dubilier Electronics	CAP TANT 2.2UF 10% 25V AXIAL	0

Tantalum Capacitors

Tantalum capacitors are a type of electrolytic capacitor known for their high capacitance density, stability, and reliability. Utilizing tantalum metal as the anode material, these capacitors form a thin insulating oxide layer as the dielectric, enabling efficient charge storage in compact sizes. Their ability to maintain stable capacitance under varying temperatures and voltages makes them critical components in modern electronics, particularly in applications requiring long-term performance and miniaturization, such as consumer electronics, automotive systems, and medical devices.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Solid Electrolyte Tantalum Capacitors	High reliability, low leakage current, and stable performance at elevated temperatures	Power supply circuits in smartphones, laptops, and industrial control systems
Wet Electrolyte Tantalum Capacitors	High capacitance values, excellent stability over time	Aerospace systems, military equipment, and high-reliability energy storage
Polymer Electrolyte Tantalum Capacitors	Low equivalent series resistance (ESR), improved safety, and vibration resistance	Medical implants (e.g., pacemakers), automotive sensors, and high-frequency circuits

3. Structure and Composition

A typical tantalum capacitor consists of four key components:

Anode: Sintered tantalum metal pellet with porous structure for increased surface area.
Dielectric: A thin layer of tantalum pentoxide (Ta₂O₅) formed electrochemically on the anode surface.
Electrolyte: Conductive material (solid MnO₂, liquid electrolyte, or conductive polymer) serving as the cathode.
Encapsulation: Epoxy resin or ceramic casing for mechanical protection and electrical insulation.

This layered structure ensures high capacitance density while maintaining stability under thermal and electrical stress.

4. Key Technical Specifications

Parameter	Description	Importance
Capacitance (C)	Range: 0.1 F to 1000 F	Determines energy storage capacity and filtering effectiveness
Rated Voltage (V_R)	Typically 2.5V to 50V	Defines safe operating voltage range without dielectric breakdown
Leakage Current	Typically < 0.01 C V_R A	Affects circuit efficiency and long-term reliability
Equivalent Series Resistance (ESR)	0.1 to 10 (varies by type)	Impacts high-frequency performance and thermal dissipation
Operating Temperature Range	-55 C to +125 C	Determines suitability for industrial and automotive applications

5. Application Fields

Consumer Electronics: Mobile phones (decoupling circuits), laptops (power management), and wearable devices.
Automotive: Engine control units (ECUs), ADAS sensors, and infotainment systems.
Medical Devices: Pacemakers, defibrillators, and diagnostic imaging equipment.
Aerospace: Avionics systems, satellite power supplies, and radar equipment.

6. Leading Manufacturers and Representative Products

Manufacturer	Product Series	Key Features
AVX Corporation	TAJ Series	Low ESR polymer capacitors for high-frequency applications
KEMET Electronics	T511 Series	Military-grade wet electrolyte capacitors with extended lifespan
Vishay Intertechnology	TVCQ Series	Automotive-qualified capacitors with AEC-Q200 compliance

7. Selection Guidelines

Key factors to consider when selecting tantalum capacitors:

Operating Conditions: Ensure rated voltage exceeds circuit requirements by 20-50% to prevent voltage spikes.
Temperature Requirements: Choose appropriate dielectric materials for extreme temperature environments.
Size Constraints: Polymer electrolyte types offer lower ESR in smaller packages for space-limited designs.
Reliability Needs: Prioritize hermetically sealed packages for mission-critical applications (e.g., aerospace).
Cost vs. Performance: Solid electrolyte capacitors provide optimal cost-effectiveness for general electronics.

Always verify compliance with industry standards such as MIL-PRF-55365 for military use or AEC-Q200 for automotive applications.

8. Industry Trends and Future Outlook

Key development trends include:

Miniaturization: Advancements in powder sintering technology enable 0603/0402 package sizes with capacitance above 100 F.
High-Temperature Stability: New dielectric materials extend operational limits to 200 C for EV and 5G infrastructure.
ESR Reduction: Conductive polymer electrolytes now achieve ESR below 10m for high-efficiency power systems.
Environmental Compliance: Lead-free terminations and RoHS-compliant encapsulation materials becoming standard.
Integration: Embedded tantalum capacitors in SiP (System-in-Package) modules for advanced computing.

The global market is projected to grow at 6.2% CAGR through 2030, driven by demand in IoT devices, electric vehicles, and medical electronics.